Patent
Optical receiving circuit
Shunei Yoshimatsu,俊英 吉松,Satoshi Kodama,聡 児玉,Yoshifumi Muramoto,好史 村本 +5 more
- 13 Jun 2011
6
TL;DR: In this article, a ground pad is constructed on an upper surface of a TIA chip connected to a light receiving element, which is connected via a bonding wire 54 to a ground potential.
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Abstract: PROBLEM TO BE SOLVED: To obtain good frequency characteristics while reducing the number of steps required for chip mounting, in an optical receiving circuit.SOLUTION: A ground pad 24 formed on an upper surface of a TIA chip 20 connected to a light receiving element 11 is connected via a bonding wire 54 to a ground pad 14 formed on an upper surface of a PD submount 10 and connected to a ground potential.
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Citations
Patent
Integrated optical semiconductor device and integrated optical semiconductor device assembly
Ryuji Masuyama,Yoshihiro Yoneda,Hideki Yagi,Naoko Konishi +3 more
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TL;DR: In this article, an integrated optical semiconductor device includes a substrate including first and second regions, a plurality of light receiving devices disposed in the second region, a multimode interference coupler disposed in first region, the multimode interferer including output optical waveguides optically coupled to the corresponding light receiving device; first and secondary conductive layers disposed on a back surface of the substrate in the first andsecond regions, respectively; and a pluralityof capacitors disposed on the second surface, each of the capacitors including a first electrode connected to one of the light receptive devices and a
7
Patent
Optical receiving circuit and method for manufacturing the same
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- 01 Oct 2014
TL;DR: In this paper, an optical receiving circuit which suppresses a characteristic deterioration due to a wiring between a PD and a TIA and a method for manufacturing the optical receiving circuits is provided, where the authors show that the characteristic impedance of the wiring between the anode of the photodiode ( 302 ) and the transimpedance amplifier ( 308 ) is higher than the characteristic voltage difference of the wires between the cathode of an anode and an amplifier.
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TL;DR: In this article, a dispersion liquid including one of thiophene and derivatives thereof, a polyanion, and a solvent is prepared, which is mixed with a first oxidizing agent producing iron ions so as to oxidatively polymerize the material.
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TL;DR: In this paper, the authors describe a semiconductor optical device consisting of a substrate having first to fourth regions, a 90-degree optical hybrid provided in the third region on a principal surface of the semiconductor substrate, first and second waveguides providing in the first region and being optically coupled to the 90 degree optical hybrid, a photodiode provided in fourth region, a third waveguide provided in second region, and a metal layer provided on a back surface of a semiconducting substrate.
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References
Patent
Light-receiving module
Kenichiro Kohmoto,Takeshi Sekiguchi,Motoyoshi Tanaka,Makoto Ito +3 more
- 26 Feb 2003
TL;DR: An optical module comprises a photodiode, an amplifying device, and a die capacitor as mentioned in this paper, which is mounted on a mounting surface of the module so as to locate the photode to be center of the surface.
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Patent
Optical receiver and optical transmitter
Takatoshi Yagisawa,Tadashi Ikeuchi +1 more
- 29 Nov 2011
TL;DR: In this paper, the optical receiver includes a board to be coupled with an optical transmission line array, an optical diode array disposed on the board, and a plurality of photo diodes each of which receives light from a corresponding optical transmission lines in the optical transmission array.
25
Photoreceiver module using an InP HEMT transimpedance amplifier for over 40 gb/s
Hiroyuki Fukuyama,Kimikazu Sano,K. Murata,H. Kitabayashi,Yasuro Yamane,Takatomo Enoki,Hirohiko Sugahara +6 more
TL;DR: In this paper, the authors developed a photoreceiver module for over 40 Gb/s that uses two ultrahigh speed device technologies: an InP HEMT transimpedance amplifier (TIA) and a uni-traveling-carrier photodiode (UTC-PD).
22
Patent
Optical receiving module, optical receiver and optical fiber communication equipment
Shuichi Hasegawa,Hironori Irie,Hironari Matsuda,Atsushi Miura,Toshiaki Ozaki,篤 三浦,裕紀 入江,俊明 尾崎,弘成 松田,修一 長谷川 +9 more
- 25 Oct 2001
TL;DR: In this paper, a bypass capacitor for a bias power source for the light receiving element is connected with the ground side directly or via serial resistors and impedances, which can enhance frequency characteristics without impairing assembling workability in an optical receiving module.
10
Patent
Parallel transmission/reception module
Miki Kuhara,Naoyuki Yamabayashi,直之 山林,美樹 工原 +3 more
- 13 Feb 2002
TL;DR: In this article, the authors proposed an optical transmission/reception module having a plurality of channels, which can suppress electric and optical crosstalk and can be connected to a standard connector.
9