Journal Article10.1016/J.APSUSC.2013.12.135
Low temperature plasma sintering of silver nanoparticles
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TL;DR: In this article, the authors studied sintering of silver nanoparticle (AgNP) films on glass substrates by applying argon (Ar) plasma to achieve improved electrical conductivity.
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About: This article is published in Applied Surface Science. The article was published on 28 Feb 2014. The article focuses on the topics: Plasma processing & Sintering.
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Citations
Conductive nanomaterials for 2D and 3D printed flexible electronics
TL;DR: This review describes recent developments in the field of conductive nanomaterials and their application in 2D and 3D printed flexible electronics, with particular emphasis on inks based on metal nanoparticles and nanowires, carbon nanotubes, and graphene sheets.
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Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices
TL;DR: In this paper, the advances in alternative sintering approaches for conductive, metal containing inks, which can be processed by inkjet-printing processes are examined regarding their mechanism, their compatibility with commonly used materials in the field of flexible electronics, its compatibility with high-throughput manufacturing processes and its applicability to the production of flexible electronic devices.
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A Review on Printed Electronics: Fabrication Methods, Inks, Substrates, Applications and Environmental Impacts
Jenny Wiklund,Alp Karakoç,Toni Palko,Huseyin Yigitler,Kalle Ruttik,Riku Jantti,Jouni Paltakari +6 more
- 13 Aug 2021
TL;DR: In order to understand the potential and future prospects of the printed electronics, the present paper summarizes the basic principles and conventional approaches while providing the recent progresses in the fabrication and material technologies, applications and environmental impacts as mentioned in this paper.
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3D Printed Electronics: Processes, Materials and Future Trends
TL;DR: In this paper , the authors provide an in-depth overview of the latest 3D electronic printing techniques and developments in innovative practical technologies used to fabricate 3D printed electronics devices.
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Inkjet-printed flexible sensors: from function materials, manufacture process, and applications perspective
TL;DR: In this article , a comprehensive summary and analysis of functional materials, fabrication and characterization techniques in the full fabrication process of inkjet printed flexible sensors are presented for promoting its vitality and prosperity.
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References
Inkjet Printing—Process and Its Applications
TL;DR: This Progress Report provides an update on recent developments in inkjet printing technology and its applications, which include organic thin-film transistors, light-emitting diodes, solar cells, conductive structures, memory devices, sensors, and biological/pharmaceutical tasks.
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TL;DR: In this paper, correction factors are evaluated for the measurement of sheet resistirities on two-dimensional rectangular and circular samples with the four-point probe, and the factors are also useful in obtaining body resistivities on thin samples.
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Sintering: Densification, Grain Growth and Microstructure
Suk-Joong L. Kang
- 01 Jan 2005
TL;DR: Basis of Solid State Sintering Models and Densification Grain Growth Microstructure Development Sintered of Ionic Compounds Liquid Phase SinterING as discussed by the authors... ]
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Polymer solar cell modules prepared using roll-to-roll methods: Knife-over-edge coating, slot-die coating and screen printing
TL;DR: In this article, a complete polymer solar cell module was constructed using all-solution processing with no vacuum steps and full roll-to-roll (R2R) processing.
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All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles
Seung Hwan Ko,Heng Pan,Costas P. Grigoropoulos,Christine K. Luscombe,Jean M. J. Fréchet,Dimos Poulikakos +5 more
TL;DR: In this article, the authors demonstrate that laser sintering of inkjet-printed metal nanoparticles enables low-temperature metal deposition as well as high-resolution patterning to overcome the resolution limitation of the current inkjet direct writing processes.