Patent
Display module, binding detection system and binding system
Cai Zhenfei,Xu Pan,Li Yongqian,Cao Kun,Cheng Xuelian,Cheng Rongmei +5 more
- 31 May 2017
9
TL;DR: In this paper, a display module, a binding detection system and a binding system is presented, where the COF is bound to a binding area of the display panel and the first alignment identifiers are arranged on at least one side of the binding area along the direction, close to the edge of a display panel.
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Abstract: The invention provides a display module, a binding detection system and a binding system and relates to the technical field of display. Whether a COF is qualified or not can be automatically detected, so that the waste of a binding material is reduced and the binding efficiency is improved. The display module comprises a display panel and the COF, wherein the COF is bound to a binding area of the display panel; the display panel also comprises first alignment identifiers; the first alignment identifiers are arranged on at least one side of the binding area along the direction, close to the edge of the display panel, of the binding area; the COF also comprises second alignment identifiers; the second alignment identifiers are in one-to-one correspondence with the first alignment identifiers; the second alignment identifiers are used for being aligned at the first alignment identifiers, wherein the first alignment identifiers are of a hollow structure; the second alignment identifiers are of a solid structure; and the second alignment identifiers can be embedded into the hollow parts of the first alignment identifiers.
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Citations
Patent
Array substrate, chip on film and alignment method thereof, and display apparatus
Liu Renjie,Wang Xiangqian,Chen Lingyan +2 more
- 04 Sep 2018
TL;DR: In this article, an array substrate, a chip on film, a display apparatus, and an alignment method of the array substrate and the chip-on-film were provided. But the alignment method was not described.
2
Patent
Automatic COF (chip on film) pressing accuracy compensation method and system and COF binding machine
Wu Jianjun
- 12 Dec 2017
TL;DR: In this paper, an automatic COF (chip on film) pressing accuracy compensation method is proposed, which includes the steps: binding a certain number of products according to current binding specifications in a current production cycle by a COF binding machine; receiving calculated binding deviation values of the generated products bound by the binding machine in the current production process from a COFs inspection machine, correcting the current binding specification on the products according according to the received binding deviations values after reaching a next production cycle, and further continuing binding to generate products with the corrected binding specifications.
1
Patent
Novel FOG bonding pad design
Qi Shengli,Wang Jian,Sun Bin,Shen Hong,Li Xiaohua +4 more
- 17 Jan 2020
TL;DR: In this article, a novel FOG bonding pad design was proposed, where the bonding pads of the flexible circuit board and the bonding pad on the glass panel are designed on the same straight line, and the slope of each bonding pad changes according to different expansion and shrinkage coefficients of different materials and different areas.
Patent
Array substrate, chip on film, and alignment method
Liu Renjie,Wang Xiangqian,Chen Lingyan +2 more
- 30 May 2019
TL;DR: In this article, an array substrate, a chip on film and an alignment method are used to detect an alignment deviation between the first pin and the second pin in a chip-on-film (COSF) system.
Patent
Display module and manufacturing method thereof
Zhao Yingchun
- 28 Jun 2019
TL;DR: In this article, a display module and a manufacturing method consisting of a first step of fixing a target panel to a first carrier, a second step of attaching the control module to the target panel by using a pressing process is described.
References
Patent
Construction of alignment mark of semiconductor device array chip and its arranging method
Kinoshita Taku
- 06 Sep 2007
TL;DR: In this article, a normal wire 14 of a width of W (a few micrometers to 10 μm) is provided with a rectangular cutout 16 in its right edge which makes its partial width two-thirds of its original width.
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