Embodiments of the invention provide an array substrate, a chip on film, a display apparatus, and an alignment method of the array substrate and the chip on film. At least one first pin of the array substrate is used for being correspondingly connected with at least one second pin on the chip on film; a first alignment mark is arranged on at least one side of the at least one first pin and used for being aligned to a second alignment mark on the chip on film; and a first offset mark is obtained through the first alignment mark and the second alignment mark, arranged on at least one side of thefirst pin, and used for indicating the alignment error of the first alignment mark and the second alignment mark. By virtue of the array substrate, the chip on film, the display apparatus, and the alignment method of the array substrate and the chip on film, accurate alignment of the pins of the array substrate and the chip on film can be realized.

Array substrate, chip on film and alignment method thereof, and display apparatus

The invention provides an automatic COF (chip on film) pressing accuracy compensation method which includes the steps: binding a certain number of products according to current binding specifications in a current production cycle by a COF binding machine; receiving calculated binding deviation values of the generated products bound by the COF binding machine in the current production cycle from a COF inspection machine, correcting the current binding specifications on the products according to the received binding deviation values after reaching a next production cycle, and further continuing binding to generate products according to the corrected binding specifications. By the method, deviation tendency can be automatically analyzed according to data, offset is automatically compensated in advance, and process stability is improved.

Automatic COF (chip on film) pressing accuracy compensation method and system and COF binding machine

The invention relates to a novel FOG bonding pad design, and belongs to the technical field of bonding pads. The bonding pads of the flexible circuit board and the bonding pads on the glass panel aredesigned on the same straight line, the slope of each bonding pad changes according to different expansion and shrinkage coefficients of different materials and different areas, and the bonding pads are in a radial shape as a whole. The relative positions of the bonding pads of the flexible circuit board and the bonding pads on the glass panel are adjusted to accurately align the bonding pads of the flexible circuit board and the bonding pads on the glass panel; and the bonding is carried out. The design has the beneficial effects that the problems of deviation, short circuit and the like caused by expansion and shrinkage in the production, processing and bonding processes of the flexible circuit board are solved, and the product yield is improved; the maximum bonding pad contact area is ensured to be obtained in the bonding processing to the greatest extent, and the problem of bonding deviation of the bonding pad can be effectively solved; requirements on expansion and shrinkage coefficients of base materials used by the flexible circuit board can be reduced, and production cost is saved.

Novel FOG bonding pad design

Embodiments of the present application provide an array substrate, a chip on film and an alignment method. The array substrate includes a first pin correspondingly connected with a second pin on a chip on film; a first alignment mark located in a preset alignment range of the first pin and aligned with a second alignment mark on the chip on film; and a first offset mark located in the preset alignment range of the first pin, obtained according to the first alignment mark and the second alignment mark and configured to indicate an alignment deviation between the first pin and the second pin.

Array substrate, chip on film, and alignment method

The invention provides a display module and a manufacturing method thereof. The manufacturing method comprises a step of fixing a target panel to a first carrier, a step of fixing a control module toa second carrier, a step of moving the first carrier or/and the second carrier such that a first alignment pin on the target panel is aligned with a second alignment pin on the control module, and a step of attaching the control module to the target panel by using a pressing process. According to the invention, at least one pin on the control module and the target panel is taken as an alignment mark, the alignment difficulty of the control module and the target panel is reduced, the alignment accuracy of the control module and the target panel is improved, and the quality and yield of the panel are improved.

Display module and manufacturing method thereof

The invention provides a display module, a binding detection system and a binding system and relates to the technical field of display. Whether a COF is qualified or not can be automatically detected, so that the waste of a binding material is reduced and the binding efficiency is improved. The display module comprises a display panel and the COF, wherein the COF is bound to a binding area of the display panel; the display panel also comprises first alignment identifiers; the first alignment identifiers are arranged on at least one side of the binding area along the direction, close to the edge of the display panel, of the binding area; the COF also comprises second alignment identifiers; the second alignment identifiers are in one-to-one correspondence with the first alignment identifiers; the second alignment identifiers are used for being aligned at the first alignment identifiers, wherein the first alignment identifiers are of a hollow structure; the second alignment identifiers are of a solid structure; and the second alignment identifiers can be embedded into the hollow parts of the first alignment identifiers.

Display module, binding detection system and binding system

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Display module, binding detection system and binding system