Patent
Wafer cooling device
Thomas W. Mountsier,James Wing +1 more
- 16 Feb 1996
76
TL;DR: In this article, a wafer cooling device (WCD) for cooling a substrate, such as a Wafer, during processing is presented, where the substrate is mounted to an WCD heat transfer surface, thereby forming a cavity in between the substrate and the heat-transfer surface into which gas is incorporated.
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Abstract: A wafer cooling device (WCD) for cooling a substrate, such as a wafer, during processing is presented. The substrate is mounted to an WCD heat transfer surface, thereby forming a cavity in between the substrate and the heat transfer surface into which gas is incorporated. An array of protuberances within the cavity provide support for the wafer. Contact heat conduction between the substrate and WCD is reduced by reducing the amount of direct contact between the substrate and WCD. Thus the heat transfer coefficient from the substrate, and hence substrate temperature, is controlled by adjusting the gas pressure in the cavity. In alternative embodiments, gas distribution channels are formed in the WCD heat transfer surface to increase gas pressure uniformity between the wafer and the WCD thus improving temperature uniformity across the substrate.
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Citations
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Thermal contact conductance
TL;DR: In this paper, the authors consider the resistance to the flow of heat between two thick solid bodies in contact in a vacuum and compare the performance of single idealized contacts with results of recent electrolytic analog tests to predict the conductance of multiple contacts.
1K
Patent
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Kenji Ishikawa,Mitsuaki Komino,Tadashi Mitui,Teruo Iwata,Izumi Arai,Yoshifumi Tahara +5 more
- 17 Dec 1993
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435
Patent
Patterned susceptor to reduce electrostatic force in a CVD chamber
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- 18 May 1994
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343
Patent
Induction plasma source
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