Patent
Substrate processing apparatus and substrate processing method
Hiroyuki Kanda,Akira Susaki,Satoru Yamamoto,Tsutomu Nakada +3 more
- 10 Oct 2007
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TL;DR: In this article, a substrate processing apparatus can carry out removal of a passive layer present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer.
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Abstract: A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide) from the ruthenium film. The substrate processing apparatus includes: an electrolytic processing apparatus for electrochemically removing a passive layer, formed on a surface of a ruthenium film on a substrate, by electrolytic processing with the ruthenium film as a cathode; a copper electroplating apparatus for carrying out copper electroplating on the surface of the ruthenium film on the substrate; and an apparatus frame housing the electrolytic processing apparatus and the copper electroplating apparatus.
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Citations
Patent
Temperature setting method of thermal processing plate, computer-readable recording medium recording program thereon, and temperature setting apparatus for thermal processing plate
Megumi Jyousaka,Shinichi Shinozuka,Kunie Ogata +2 more
- 20 Sep 2007
TL;DR: In this paper, the line widths within the substrate which has been subjected to a photolithography process are measured, and an in-plane tendency of the measured line width is decomposed into a plurality of inplane tendency components using a Zernike polynomial.
29
Patent
Methods and apparatus for vertically orienting substrate processing tools in a clean space
Frederick A. Flitsch
- 14 Sep 2006
TL;DR: In this paper, the authors present various aspects of support for a fabrication facility capable of routine placement and replacement of processing tools in at least a vertical dimension relative to each other, in order to support the fabrication process.
14
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Heating control system, deposition device provided therewith, and temperature control method
Sakagami Hidekazu,Okada Toshinori +1 more
- 29 Mar 2011
TL;DR: In this article, a heating control system with a thermocouple (6M) and a temperature controller (3M) for detecting the temperature of an object to be heated by a plurality of heaters is presented.
11
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Heat Treatment Method, Recording Medium Having Recorded Program for Executing Heat Treatment Method, and Heat Treatment Apparatus
Kenichi Shigetomi,Jun Ookura +1 more
- 27 Jul 2011
TL;DR: In this article, a method of a thermal processing including a first process and a second process is described, where a set temperature of a heating plate from a first temperature to a second temperature which is lower than the first temperature is changed after the first process for the first substrate is completed.
11
Patent
Method and apparatus to support a cleanspace fabricator
Frederick A. Flitsch
- 15 Aug 2006
TL;DR: In this paper, the authors present various aspects of support for a fabrication facility capable of routine placement and replacement of processing tools, including support structure for processing tools and a clean environment carrier for a single substrate.
10
References
Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing
Thomas P. Moffat,Marlon L. Walker,P J. Chen,John E. Bonevich,William F. Egelhoff,Lee J. Richter,C Witt,Titta Aaltonen,Mikko Ritala,Markku Leskelä,Daniel Josell +10 more
TL;DR: In this paper, the authors show that the Cu nucleation and growth mode is sensitive to the oxidation state of the Ru surface as well as the copper deposition parameters, and that early film coalescence is favored by deposition at high (η -0.25 V) overpotentials.
Patent
Plating method and plating apparatus
Satoshi Kaneko
- 13 Jan 2005
TL;DR: In this article, a plating method for small parts without any deformation is described, in which an object product to be plated is put in each accommodating concave portion in a carrier tape and this carrier tape is passed through a metal plating apparatus so as to form metallic plating layer on the surface of the object product.
73
Patent
Method for applying metal features onto barrier layers using electrochemical deposition
Rajesh Baskaran,Bioh Kim,Linlin Chen,Lyndon W. Graham +3 more
- 10 Jan 2003
TL;DR: In this paper, a process for producing structures containing metallized features for use in microelectric workpieces is proposed, which treats a barrier layer to promote the adhesion between the barrier layer and the metalized feature.
48
Patent
Plating of a thin metal seed layer
Nicolay Kovarsky,You Wang,John O. Dukovic,Ivan Rodriguez +3 more
- 01 Mar 2006
TL;DR: In this paper, an apparatus and method for plating a metal layer onto a substrate is described, where an anolyte volume having one or more anode segments positioned therein is ionically separated from the catholyte volumes.
45
Patent
Method for electroplating on resistive substrates
Panayotis C. Andricacos,Hariklia Deligianni,Wilma Jean Horkans,Keith T. Kwietniak,Michael Lane,Sandra G. Malhotra,Fenton R. McFeely,Conal E. Murray,Kenneth P. Rodbell,Philippe M. Vereecken +9 more
- 15 Oct 2002
TL;DR: In this paper, a conductive material is electroplated onto a platable resistive metal barrier layer employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal.
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