Patent
Solid-state imaging device and method for manufacturing the same, and electronic apparatus
Hiroshi Takahashi,洋 高橋 +1 more
- 07 Nov 2008
6
TL;DR: In this article, the authors proposed a solution to perform potential control over a channel region of each charge readout transistor of a CMOS solid-state imaging device while making a pixel size very small by employing vertical gate electrode for a gate electrode of the charge read-out transistor.
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Abstract: PROBLEM TO BE SOLVED: To surely perform potential control over a channel region of each charge readout transistor of a CMOS solid-state imaging device while making a pixel size very small by employing vertical constitution for a gate electrode of the charge readout transistor. SOLUTION: The solid-state imaging device includes a substrate 20, photodiodes PD1 and PD2 buried in the substrate 20, a vertical gate electrode 26 of a charge readout transistor Tr1 buried along the depth of the substrate so as to read signal charge out of the photodiodes PD1 and PD2, and planar gate electrodes 31 and 33 of other transistors Tr2 and Tr3 formed of an electrode material different from that of the vertical type readout gate electrode 26. COPYRIGHT: (C)2010,JPO&INPIT
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Citations
Patent
Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatus
Ryosuke Nakamura,Fumihiko Koga,Taiichiro Watanabe +2 more
- 09 May 2014
TL;DR: In this paper, a solid-state image pickup device including a semiconductor substrate (21), a photodiode (11A, 11B) formed in the semiconductor substrates, and a transistor (10) having a gate electrode (14) part or all of which is embedded in the substrate, the transistor being configured to read a signal electric charge from the photodiodes via the gate electrode.
16
Patent
Solid state imaging element, solid state imaging element manufacturing method and electronic apparatus
Hideo Kido
- 28 Feb 2013
TL;DR: In this article, the authors proposed a solid state imaging element consisting of a first photodiode PD1 formed on a side of a surface 51A of a semiconductor substrate and a second PD2 created on a rear face 51B.
6
Patent
Solid-state imaging device, method of manufacturing the same, and electronic equipment
中村 良助,Ryosuke Nakamura,良助 中村,史彦 古閑,Fumihiko Koga,泰一郎 渡部,Yasuichiro Watabe +6 more
- 16 May 2013
TL;DR: In this article, the authors proposed a solid-state imaging device consisting of a semiconductor substrate, a photodiode formed in the substrate, and a transistor having a gate electrode at least a part of which is embedded in the semiconductor substrategies.
4
Patent
Photoelectric conversion device, and manufacturing method of photoelectric conversion device
Mineo Shimotsusa,Masaji Itabashi,Yusuke Onuki,Nobuaki Kakinuma,Fujita Masato +4 more
- 23 May 2016
TL;DR: In this article, a photoelectric conversion device was proposed to improve the performance of a pixel circuit by masking a portion of the first gate electrode positioned on the semiconductor region and introducing an impurity into a source/drain region of a MOS transistor.
1
Patent
Imaging element, imaging device, and manufacturing apparatus and method
Fukuoka Shinpei
- 01 Feb 2018
TL;DR: In this article, the authors proposed an imaging element, an imaging device, and a manufacturing apparatus and a method that facilitate electric charge transfer, which can be applied to imaging elements, imaging devices, and manufacturing apparatuses and methods.
References
Patent
Method for manufacturing semiconductor device
Shiratake Shigeru
- 02 May 2007
TL;DR: In this paper, a method for manufacturing a semiconductor device whereby the process is simplified and high performance can be obtained in both a trench-gate transistor and a planar transistor that has a thin gate insulating film when the two transistors are formed on the same semiconductor substrate.
48
Patent
Semiconductor device and its manufacturing method
Kazuhiro Yoshimoto,Shimobetsupu Yuzo,Kazuo Teshirogi,Shinjo Yoshiaki +3 more
- 23 Aug 2007
TL;DR: In this article, a transparent member was mounted on the upper surface of a light receiver to prevent the transparent member and the semiconductor element from flowing into the light receiver, and the first and second projections were formed on the major surface of an element.
27
Patent
Solid-state imaging device and its manufacturing method, and electronic information equipment
Akiyoshi Muto,彰良 武藤 +1 more
- 03 Apr 2007
TL;DR: In this paper, the authors proposed a solid-state imaging device which does not require color filters and can read out signal charges corresponding to a plurality of colors, separately, at a low voltage and has high sensitivity and high resolution.
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