Patent
Semiconductor wafer plating cathode assembly
Greg Davis,Alex Moffatt,D. Morgan Tench,John T. White +3 more
- 02 Nov 2001
32
TL;DR: In this paper, a polymer coating on a metal structural ring is used to provide a low profile seal to the perimeter of the wafer surface to be plated, which can be used in contact with the plating solution and still be part of the electrical contact system.
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Abstract: A cathode assembly for semiconductor wafer plating employs a polymer coating on a metal structural ring to provide a low-profile seal to the perimeter of the wafer surface to be plated. The polymer coating also electrically insulates the metal so that it can be used in contact with the plating solution and still be part of the electrical contact system, eliminating the need for a protective plastic housing. This invention permits the dimensions of the cathode assembly to be minimized. A compact cathode assembly with minimum protrusion above the wafer plated surface enables modifications to the plating cell and agitation system providing more uniform copper deposits across the wafer surface and facilitating automation of the wafer plating process.
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Citations
Patent
Substrate Processing Apparatus
Tamami Takahashi,Mitsuhiko Shirakashi,Kenya Ito,Kazuyuki Inoue,Kenji Yamaguchi,Masaya Seki +5 more
- 16 Feb 2005
TL;DR: In this article, a bypass pipe is connected between the mechanical booster pump and the rest vacuum pumps located at a downstream side of the booster pump to prevent the exhaust gas from diffusing back to the inside of a process chamber.
644
Patent
Apparatus and method for predetermined component placement to a target platform
Kong-Chen Chen
- 13 May 2010
TL;DR: In this article, the alignment and probing techniques to improve the accuracy of component placement in assembly are described, which includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks under various probing techniques.
63
Patent
Electronic assembly with detachable components
Kong-Chen Chen
- 14 Jul 2010
TL;DR: In this paper, an electronic assembly including a substrate, an electronic component, a fixture, and a housing is presented, where the electronic component includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.
35
Patent
Methods and apparatuses for cleaning electroplating substrate holders
Santosh Kumar,Bryan L. Buckalew,Steven T. Mayer,Thomas A. Ponnuswamy,Chad Michael Hosack,Robert Rash,Lee Peng Chua,David W. Porter +7 more
- 27 Mar 2013
TL;DR: In this article, the authors present methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electro-plating operations.
25
Patent
Lipseals and contact elements for semiconductor electroplating apparatuses
Jingbin Feng,Marshall Stowell,Frederick D. Wilmot +2 more
- 13 Aug 2012
TL;DR: In this paper, an elastomeric lipseal is used to support, align, and seal a substrate in a clamshell, and it is configured to move inward and align the substrate upon compression of the top surface.
25
References
Patent
Cathode contact ring for electrochemical deposition
Joe Stevens
- 30 Nov 1998
TL;DR: In this article, a cathode contact ring for use in an electroplating cell is presented. The contact ring comprises an insulative body having a substrate seating surface and one or more conducting members disposed in the body.
217
Patent
Clamshell apparatus for electrochemically treating semiconductor wafers
Evan E. Patton,Wayne Fetters +1 more
- 26 Oct 1998
TL;DR: In this article, the compliant seal forms a seal with the perimeter region of the wafer surface preventing plating solution from contaminating the edge, wafer backside and the contacts.
174
Patent
Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
Hui Wang,Felix Gutman,Voha Nuch +2 more
- 24 Nov 1999
TL;DR: A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes an actuator assembly for moving the Wafer chuck between a first and a second position.
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