Semiconductor device and manufacturing method therefor

TL;DR: In this article, an outer circumferential resin case of a semiconductor device is used as a common component to provide a package assembling structure improved to flexibly cope with any type and the user-specified specifications.

Abstract: PROBLEM TO BE SOLVED: To provide a package assembling structure improved to flexibly cope with any type and the user-specified specifications, by making an outer circumferential resin case of a semiconductor device as a common component. SOLUTION: In the semiconductor device comprises an outer circumferential resin case 5 assembled to a board assembly body comprising a metallic base 1, an insulating circuit board 2, and a semiconductor chip 3; and an L shape leg part 6a of an external terminal 6 arranged on a peripheral wall of the resin case protruding into the inside of the case to connect a wiring conductor between the insulating circuit board and the semicoductor chip, a number of terminal fixing holes 5a are cast formed, in advance, around the peripheral wall of the outer circumferential resin case 5; the external terminal 6 required to the terminal fixing hole later is fixed later; and further, the both ends of the wiring conductor as the lead frame 10 are assembled to the external terminal, the insulating circuit board, the semiconductor chip through an ultrasonic junction, a laser welding, or a solder junction. Furthermore, the terminal fixing holes 5a are allocated at the peripheral wall part of the resin case to correspond to any terminal arrangement varying depending on the type, and the external terminal required to the terminal fixing hole selected in matching with the specification at production assembling is pressed and fixed. COPYRIGHT: (C)2009,JPO&INPIT