Patent
Power semiconductor device package
H Stryker
- 24 Sep 1973
50
TL;DR: In this paper, a power semiconductor device package that includes a ceramic substrate having a plurality of discrete solderable contact pads is presented, and a semiconductor die is soldered to one of the contact pads.
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Abstract: A power semiconductor device package that includes a ceramic substrate having a plurality of discrete solderable contact pads. A semiconductor die is soldered to one of the contact pads. The substrate in turn is mounted on a metallic package base member. A tri-layered terminal lead is provided for soldering to the contact pads. Each terminal lead has an outer layer of solder on one surface, a middle layer of stainless steel, and a layer of aluminum on an opposite surface. Aluminum filamentary wires extend from the die to the aluminum layer of the terminal leads. A non-rigid material on the die and over the filamentary wires protects the same from contaminants and possible damage during production. A plastic encapsulation covers the substrate except for a portion of the metallic package base member and outer ends of the terminal leads.
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Citations
Patent
Package for semiconductor power device and method for assembling the same
Toshio Shimizu,Hiroyuki Hiramoto,Hiroki Sekiya,Kenji Kigima +3 more
- 08 Dec 1998
TL;DR: In this article, a thermoplastic insulating resin is employed instead of the silicone gel to prevent a creeping discharge in a semiconductor power device, where a bottom plate is formed in the bottom plate, and the notch is filled with a high heat conductive resin.
113
Patent
Microcircuit package and sealing method
Jeremy D. Scherer
- 12 Oct 1983
TL;DR: In this paper, the thermal coefficients of the materials are complementary and thus form a highly reliable, durable seal, while also insulating the microcircuit during the process of applying the non-organic coating.
111
Patent
Integrated circuit package utilizing novel heat sink structure
Hodge Robin H
- 17 Mar 1975
TL;DR: An integrated circuit package for power applications including a novel heat sink structure affixed to the die mounting pad, the heat sink being exposed through the bottom surface of the plastic encapsulated package so as to be free of any plastic film covering as mentioned in this paper.
84
Patent
Electronic multichip module
Otto G. Schwede
- 06 May 1977
TL;DR: In this article, an electronic multichip module suitable for use in a hostile environment is presented. The module includes a metallic base member and a metallic cover hermetically and metallically sealed to the base member, the base members and cover together forming an enclosure.
63
Patent
Semiconductor circuit packages for use in high power applications and method of making the same
Klaus Sachs
- 06 May 1988
TL;DR: In this article, a transfer molded semiconductor circuit package with two spaced, parallel, exteriorly accessible substrate plates located symmetrically to a medial plane of the package and encapsulated, to levels flush with their remote faces, in a body of low stress semiconductor grade molding compound is presented.
52
References
Patent
Semiconductor thermal protection
J Whitney,R Woods +1 more
- 02 Jan 1973
TL;DR: In this paper, thermally responsive impedances are mounted in heat transfer contact with the semiconductor device to prevent excessive semiconductor junction temperatures, such as thermistors, semiconductor diodes, transistors and thyristors.
43
Patent
Isolated heat-sink semiconductor device
W Lootens
- 01 Mar 1972
TL;DR: In this paper, a thin ceramic electrically insulative plate of high thermal conductivity is used for attaching the inner ends of the external leads associated with the semiconductor body to provide an electrically conductive path for heat extraction.
27
Patent
Metallic contacts for semiconductor devices
Allan Harold Luxem,Richard B. Small +1 more
- 16 Sep 1965
7
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