Patent
Plating method and apparatus
Hisafumi Kaneko,Tetsuro Matsuda,Katsuya Okumura,勝弥 奥村,哲朗 松田,尚史 金子 +5 more
- 10 Feb 1999
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TL;DR: In this paper, a plating head is mounted on the surface of a conductor layer of a substrate to be processed, and eight needle-like cathode contacts are provided equally on the outermost periphery of the conductor layer.
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Abstract: PROBLEM TO BE SOLVED: To realize priority formation of a plated film on a groove or hole suitable for a damascene process SOLUTION: A plating head 110 is mounted on the surface of a conductor layer 103 of a substrate 100 to be processed The plating head 110 is directly placed on the conductor layer 103, is made up of pad 111 impregnated with PVA(polyvinyl alcohol), and containing a plating solution and of anode 112 of phosphorated copper disposed on the pad 111 and connected to a power source 113 Eight needle-like cathode contacts 120 are provided equally on the outermost periphery of the conductor layer 103
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Citations
Patent
Inductor and electric power supply using it
Yasuhiko Mano,Takashi Kariya,Shinobu Kato +2 more
- 15 May 2009
TL;DR: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween.
66
Patent
Method of manufacturing electronic device
Tetsuo Matsuda,Hisashi Kaneko +1 more
- 08 Aug 2003
TL;DR: Disclosed as mentioned in this paper is a method of manufacturing an electronic device, comprising forming a concave portion on the surface of a base member, forming an electrically conductive seed layer on that surface of the base member on which a plated film is to be formed, and applying an electrolytic plating treatment with the seed layer used as a common electrode under the condition that a substance for accelerating the electrolytic polating is allowed to be present in the concave part of the body part in an amount larger than that on the base part.
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Patent
Plating device and plating method
Keiichi Kurashina,Keisuke Namiki,Tsutomu Nakada,Koji Mishima +3 more
- 22 Jan 2004
TL;DR: A plating device capable of selectively depositing metal plating films such as copper layers in fine recessed parts for wiring formed of circuit-shaped trenches and via holes is described in this paper.
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Patent
Plating apparatus, plating method and multilayer printed circuit board
Toru Nakai,Satoru Kawai,Hiroshi Niwa,Yoshiyuki Iwata +3 more
- 23 Dec 2008
TL;DR: In this paper, a multilayer printed circuit board is constructed with a core substrate having a penetrating hole, forming an electroless plated film on a surface of the substrate and an inner wall of the penetrating-hole, electrolytically plating the substrate while moving with respect to the surface of a substrate, an insulating member in contact with the substrate, and an opening space inside the penetrating hole is filled with an electrolytic material.
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Patent
Method and Apparatus for Plating Semiconductor Wafers
Yezdi Dordi,Bob Maraschin,John M. Boyd,Fred C. Redeker,Carl Woods +4 more
- 28 Jun 2004
TL;DR: In this article, an anode is disposed over and proximate to a wafer such that a meniscus of electroplating solution is maintained between the anode and the wafer.
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