Patent
Pattern inspection method and device
Munenori Fukunishi,Koichi Hayakawa,Takashi Hiroi,Yasuhiko Nara,安彦 奈良,高志 広井,功一 早川,宗憲 福西 +7 more
- 05 Feb 2003
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TL;DR: In this paper, a pattern inspection device for comparing each image in a domain corresponding to patterns formed so as to be the same pattern is equipped with an image comparison processing part 18 constituted by using a processing system on which a plurality of CPUs to be operated in parallel are mounted.
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Abstract: PROBLEM TO BE SOLVED: To provide a pattern inspection technology capable of detecting with high sensitivity at high speed, a defect pursued by a user which is buried in noises or in defects unnecessary to be detected, by reducing brightness irregularities between comparison images generated from a difference of the film thickness or a difference of the pattern thickness, in pattern inspection. SOLUTION: This pattern inspection device for comparing each image in a domain corresponding to patterns formed so as to be the same pattern, and determining a disagreement portion in the image to be a defect is equipped with an image comparison processing part 18 constituted by using a processing system on which a plurality of CPUs to be operated in parallel are mounted. In the device, an influence of brightness irregularities between the comparison images generated from the difference of the film thickness or the difference of the pattern thickness is reduced, and highly sensitive pattern inspection can be performed without setting a parameter. Further, a characteristic quantity of each image is calculated between the comparison images, and a plurality of characteristic quantities are compared, to thereby enable highly accurate discrimination between a defect and a noise, which is impossible from a brightness value. COPYRIGHT: (C)2009,JPO&INPIT
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TL;DR: In this article, a pattern inspection device is proposed to decide mismatch sections of pictures as the defects by comparing the pictures in corresponding regions of two patterns formed to the same pattern in parallel in a plurality of regions.
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TL;DR: In this article, the authors provide technology provided with a method and a system for inspecting a defect in a circuit pattern on semiconductor materials, where an initial threshold is corrected after the defect of a trial inspection storage data is analyzed.
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