Patent
Liquid-cooling memory modules with liquid flow pipes between memory module sockets
Richard M. Barina,Vinod Kamath,Chunjian Ni,Derek I. Schmidt,Mark E. Steinke,James S. Womble +5 more
- 28 Nov 2011
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TL;DR: In this article, a liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source, and a plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block.
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Abstract: A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
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Citations
Patent
Liquid-cooled memory system having one cooling pipe per pair of DIMMs
Gerhard Ingmar Meijer,Derek I. Schmidt,Mark E. Steinke,James S. Womble +3 more
- 27 Jan 2012
TL;DR: In this article, the memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe, and an inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe.
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Patent
Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
Timothy J. Chainer,David P. Graybill,Madhusudan K. Iyengar,Vinod Kamath,Bejoy J. Kochuparambil,Roger R. Schmidt,Mark E. Steinke +6 more
- 06 May 2011
TL;DR: In this article, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a liquid-carrying channel of the liquid cooled structure, and an outdoor-aircooled heat exchange unit coupled to facilitate heat transfer from the liquid cooling structure via, at least in part, the loop.
39
Patent
Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s)
Milnes P. David,David P. Graybill,Madhusudan K. Iyengar,Vinod Kamath,Bejoy J. Kochuparambil,Pritish R. Parida,Roger R. Schmidt,Mark E. Steinke +7 more
- 20 Jun 2012
TL;DR: In this article, a thermal transfer structure of cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surfaces of the thermal spreaders and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface with docking of the electronics card within a socket of the electronic system.
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Patent
Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
Timothy J. Chainer,David P. Graybill,Madhusudan K. Iyengar,Vinod Kamath,Bejoy J. Kochuparambil,Roger R. Schmidt,Mark E. Steinke +6 more
- 21 Nov 2013
TL;DR: In this article, a liquid-cooled cold plate and a thermal spreader associated with the cold plate is presented for facilitating cooling of an electronic component, which includes a thermal conduction surface with a larger surface area than a surface area of the component to be cooled.
25
Patent
Server memory cooling apparatus
Berk Todd,Andre S. Eriksen +1 more
- 29 Jun 2012
TL;DR: In this paper, a system to aid in cooling an in-line memory module may include a heat spreader including a channel to accommodate the memory module, thermal interface material, and a liquid-cooler block including a heat-conducting cold plate and an internal liquid channel filled with circulating cooling liquid.
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TL;DR: In this article, a daughter card includes a number of circuit modules generating heat and a spring member transmitting the heat to a thermal bus extending along a circuit board adjacent to one side or to each side of a connector to which the daughter card is releasably attached.
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Patent
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Levi A. Campbell,Richard C. Chu,Michael J. Ellsworth,Madhusudan K. Iyengar,Michael Rizzolo,Robert E. Simons +5 more
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TL;DR: In this paper, a liquid-cooled cold rail has a thermally conductive structure and a coolant-carrying channel extending within and cooling the structure, and an electronics subassembly includes an electronics card and one or more thermal transfer plates.
71
Patent
Method and apparatus of water cooling several parallel circuit cards each containing several chip packages
Thomas Mario Cipolla,Shurong Tian,Evan G. Colgan,Paul W. Coteus,Shawn A. Hall +4 more
- 06 May 2008
TL;DR: A cooling or heat transfer apparatus and method for cooling an electronic device is described in this paper, which includes a heat producing electronic device which may include an electronic circuit card with many heat sources.
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Patent
Liquid cooling system
Robert D. Hrehor,Travis Christian North,Kevin M. Bailey +2 more
- 02 Oct 2008
TL;DR: In this article, a liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board, and a mounting structure is located on the board adjacent to the plurality of HPCs.
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