Patent
Lead frame for chip package, chip package, package module, and lighting system employing chip package module
Hiromi Bun,Ll Heung Choi,Jeong-Wook Lee,Yong Jin Lee,Young Hee Song +4 more
- 09 May 2011
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TL;DR: In this article, a chip package includes a first fastening and a second fastening portion that can be complementarily coupled to each other on terminal parts of a lead frame for mounting a chip thereon.
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Abstract: PROBLEM TO BE SOLVED: To provide a lead frame for chip package, a chip package, a package module, and a lighting system employing a chip package module.SOLUTION: A chip package includes a first fastening portion and a second fastening portion that can be complementarily coupled to each other on terminal parts of a lead frame for mounting a chip thereon, and thus a plurality of chip packages complementarily couple the first fastening portion and the second fastening portion, which are provided on the terminal parts, to easily embody a package module.
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Citations
Patent
Method for manufacturing optical module, and optical module
Kitatsume Makoto,Ono Tadashi,Komiyama Toshiki,Inugai Yuki +3 more
- 20 Sep 2018
TL;DR: In this article, a method for manufacturing an optical module has been proposed, which involves mounting a light-emitting element face down on a substrate having a plurality of electrodes on the surface thereof.
Patent
Led packaging structure and method for producing the same
Ke-hao Pan,Chi-Ming Wu +1 more
- 12 Aug 2016
TL;DR: In this paper, the problem of providing an LED package having a substrate, an LED chip, a phosphor sheet, and a first resin was addressed. But the problem was not solved.
Patent
Method of manufacturing optical module and optical module
Kitatsume Makoto,Ono Tadashi,Komiyama Toshiki,Inukai Yuuki +3 more
- 27 Sep 2018
TL;DR: In this paper, the authors proposed a method of manufacturing an optical module which affords for shortening of the process for manufacturing the optical module and furthermore affords to materializing reduction in height and size of the optical modules.
References
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Susumu Kurokawa,Shuji Yamamura,修司 山村,進 黒川 +3 more
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TL;DR: In this article, two frames 1, 2 composed of conductive material like copper are arranged parallel with each other, and LED's 3 are arranged in recessed parts 1a in the frame 1.
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Patent
Lead frame, and light emitting diode module having the same
Huang Shih-Chung,Lin Chen-Hsiu,Chou Meng-Sung +2 more
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TL;DR: In this article, a light emitting diode (LED) module includes a lead frame having a number (N) of conducting arms spaced apart from each other, where N ≥ 3, and at least one LED die mounted on one of any two neighbor conducting arms.
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Patent
Light emitting device package, and light emitting device package array
Yu-Sik Kim,Kyokon Kin +1 more
- 07 May 2007
TL;DR: In this article, a light emitting device package consisting of a package body composed of current carrying material where a cavity 150 is formed, which is equipped with a light-emitting device, the bottom surface 130 of the cavity where the light-eating device is mounted, and a cavity side surface 140 that reflects light emitted from the light emitting devices; a primary electrode arranged by projecting part of the package body; and a secondary electrode 120 inserted into the body.
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Patent
Light-emitting element package, and linear light-emitting device and planar light-emitting device each using the same
Takateru Sakai,Yoshiori Tachibana,佳織 立花,隆照 酒井 +3 more
- 18 Jan 2010
TL;DR: In this article, a convex portion formed on an electrode protruding from an LED package and a concave portion formed in an electrode inserted to other LED package are coupled through fitting.
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Patent
Current source circuit
Kouno Kouun
- 17 Mar 1986
TL;DR: In this paper, the output of the amplifying circuit 11 is hard to appear on the base line of the TRQ22 and the output even if appearing is voltage-divided to re/re+R21 (re: equivalent emitter resistance of TRQ3), so it is extremely small, so that no influence is exerted upon the emitter potential.
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