Laser processing apparatus and laser processing method

TL;DR: In this article, a laser processing apparatus which can simultaneously emit a plurality of laser beams onto a substrate is described, which includes a first laser oscillator to generate the first laser beam having a first wavelength and a second laser oscillators to generate a second wavelength.

Abstract: Disclosed is a laser processing apparatus which can simultaneously emit a plurality of laser beams onto a substrate. The laser processing apparatus emits a first and a second laser beam to an object to be processes, and comprises: a first laser oscillator to generate the first laser beam having a first wavelength; a second laser oscillator to generate the second laser beam having a second wavelength; a first beam splitter to split the first laser beam into a plurality of first laser beams; a second beam splitter to split the second laser beam into a plurality of second laser beams; a plurality of first scanner units to control emission directions of the divided first laser beams; a plurality of second scanner units to control emission directions of the divided second laser beams; and a plurality of optical systems arranged on propagation paths of the divided first and second laser beams. The first wavelength of the first laser beam and the second wavelength of the second laser beam emitted to the object to be process are different from each other, and a difference between the first and the second wavelength may be 5% or lower of the first wavelength.