Patent
Embedded chip package
Klaus Pressel,Gottfried Beer +1 more
- 13 Jun 2007
89
TL;DR: In this paper, an electronic assembly is described that includes at least one semiconductor chip and a package structure embedding the chip, and a substrate is embedded in the package structure.
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Abstract: An electronic assembly is disclosed. One embodiment includes at least one semiconductor chip and a package structure embedding the semiconductor chip. The package structure includes at least one conducting line extending into an area of the package structure outside of the outline of the chip. The electronic assembly further includes a substrate embedding the package structure.
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Citations
Patent
Integriertes Schaltungsmodul mit Wellenleiter-Übergangselement
Ernst Seler,Maciej Wojnowski,Walter Hartner +2 more
- 30 Oct 2014
TL;DR: In this article, an integriertes Schaltungsmodul umfasst eine Gehause-Vergussmasseschicht, eine Hochfrequenz(HF)-integrierte SchALTung, innerhalb der Gehause Vergussmasschicht eingebettet ist and einen HF-Anschluss aufweist, einem rechteckigen Wellenleitergehause gekoppelt zu werden, and eine Umverteilungsschicht
Patent
A deformable membrane and a compensating structure thereof
Lin Chung-Hsien,Joseph Seeger,Calin Miclaus,Tsung Lin Tang,Yen Pei-Wen +4 more
- 08 Apr 2019
TL;DR: In this article, a sensor includes a substrate, an electrode, a deformable membrane, and a compensating structure, which creates a bending force that is opposite to the bending force of the membrane responsive to temperature changes and thermal coefficient mismatch.
Patent
Low cost millimeter wave integrated LTCC package and method of manufacturing
Aaron Vaisman
- 19 Mar 2018
TL;DR: In this paper, the LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface.
Patent
Aluminum nitride multilayer power module interposer and method
Nootens Stephen,Polese Frank,Scrantom Steven +2 more
- 04 Feb 2021
TL;DR: A power electronic interposer for mounting a number of power transistor integrated circuit dice can be made from a multi-layer ceramic process to provide an aluminum nitride body having internal tungsten traces (30-35) to electrically connect die bond pads (17,18) to interposers contact pads (25,26) allowing connection to circuitry off of the interPOSer.
References
Patent
Method for fabricating an integrated circuit module
Raymond Albert Fillion,Robert John Wojnarowski,Michael Gdula,Herbert Stanley Cole,Eric Joseph Wildi,Wolfgang Daum +5 more
- 09 Jul 1993
TL;DR: In this article, a dielectric layer having vias aligned with predetermined ones of the contact pads and having an electrical conductor extending through the vias is situated on the hardened substrate molding material and the faces of the chips.
560
Patent
Plastic integrated circuit package and method and leadframe for making the package
Thomas P. Glenn
- 14 Jun 1999
TL;DR: In this paper, an integrated circuit die and the methods and leadframes for making such packages are disclosed and a method of making a package includes providing a metal leadframe having a die pad in a rectangular frame.
316
Patent
Microelectronic substrates with integrated devices
Quat Vu,Jian Li,Steven Towle +2 more
- 09 Oct 2001
TL;DR: In this article, a microelectronic substrate including at least one micro-electronic device is disposed within an opening in a micro electronic substrate core, wherein an encapsulation material is disposed in portions of the opening not occupied by the microelectronics devices.
287
Patent
Compact high density interconnect structure
Walter Marion Marcinkiewicz,Charles W. Eichelberger,Robert John Wojnarowski +2 more
- 01 Jul 1991
TL;DR: An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness as mentioned in this paper.
282
Patent
Integrated chip package structure using organic substrate and method of manufacturing the same
Jin-Yuan Lee,Mou-Shiung Lin,Ching-Cheng Huang +2 more
- 22 Jan 2002
TL;DR: In this paper, an integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic substrate.
255