Patent
Electronic component mounting system
Ota Katsushi
- 21 Sep 2017
5
TL;DR: In this article, an elapsed time obtaining unit obtains a time elapsed since printing of a circuit substrate (28) by a solder printing device (10), and a mounting device mounts an electronic component on solder printed on the circuit substrate through the component holder being raised and lowered in the raising/lowering movement (pressing force and pressing time) which has been changed by the changing unit.
read more
Abstract: In the present invention, an elapsed time obtaining unit obtains a time elapsed since printing of a circuit substrate (28) by a solder printing device (10). A raising/lowering movement changing unit changes a raising/lowering movement (pressing force and pressing time) of a component holder (250) on the basis of the time elapsed since the printing obtained by the elapsed time obtaining unit. A mounting device mounts an electronic component on solder printed on the circuit substrate (28) through the component holder being raised and lowered in the raising/lowering movement (pressing force and pressing time) which has been changed by the raising/lowering movement changing unit. With this configuration, mounting defects of electronic components caused by drying of solder printed on a circuit substrate can be more practically prevented.
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
Citations
Patent
Electrode bonding apparatus and electrode bonding method
Akihiro Ichinose,Yamada Yoshihito,Nishinaka Tomoyuki,Akio Yoshida +3 more
- 06 Oct 2016
TL;DR: In this paper, an object to provide an electrode bonding apparatus that performs ultrasonic vibration bonding on points of an electrode and is capable of reducing variations in a peel force among the points even when the electrode is bonded onto the substrate at a lower peel force.
1
Patent
Mounting processing unit, a mounting device, and a control method of a mounting processing unit
Koji Kawaguchi,Junichi Narita,Mitsuru Sanji,Kenzo Ishikawa +3 more
- 25 Jan 2018
TL;DR: In this paper, a mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached.
1
Patent
Component mounting system, component mounter and component mounting method
Matsushita Daisuke,Kasuga Daisuke +1 more
- 12 Jul 2018
TL;DR: In this article, the post-application elapsed time exceeds the time limit at the mounting timing at which the component is mounted in the mounting process for each applying location for each application location.
Patent
Board work machine and board work system
Kawai Hidetoshi
- 19 Jul 2018
TL;DR: In this paper, a work machine including a conveyor belt is rotated such that a protruding section is positioned on the upstream side of an end face on the opposite side to a conveyance direction of a circuit board while the circuit board is clamped by a clamping device.
Patent
Mounting processing unit for arranging components on a board
Koji Kawaguchi,Junichi Narita,Mitsuru Sanji,Kenzo Ishikawa +3 more
- 14 Apr 2020
TL;DR: In this paper, a mounting device is provided with a first raising and lowering drive section configured to raise and lower an entire syringe member to which a suction nozzle that picks up a component is attached.
References
Patent
Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
Steven L. Stewart,Carlton E. Ash +1 more
- 05 Mar 2002
TL;DR: In this article, an assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface-mounted electronic device facing the printed-circuit board and providing a gap between the thermplastic adhesive and the printed circuit boards is presented.
104
Patent
Circuit-substrate-related-operation performing system
Asai Koichi,Shinsuke Suhara,Hirokazu Ikegami +2 more
- 15 Aug 2001
TL;DR: In this article, a system for performing an operation for a circuit substrate, including a plurality of main conveyors each of which conveys, positions, and supports a substrate, is presented.
43
Patent
Method and apparatus for mass soldering with subsequent reflow soldering
Matthias F. Comerford
- 21 Feb 1985
TL;DR: In this article, an improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described.
30
Patent
Circuit board assembly
Gordon M. May
- 24 May 1979
TL;DR: In this article, an apparatus and method for assembling integrated circuits to a printed circuit board is described, where integrated circuits with protective carriers are selectively dispensed from a rotary magazine, are removed from the carriers and positioned by the leads on magnetic holders on a continuous conveyor which moves the integrated circuits, thus mounted on the holders, to a lead-forming and trim assembly wherein the leads are bent downwardly and outwardly to form feet and trimmed.
30
Patent
Circuit-component transferring apparatus
Koichi Asai,Shinsuke Suhara +1 more
- 27 Nov 1997
TL;DR: In this paper, a circuit-component transferring apparatus including a component holder (766) which includes an axial portion and a component holding portion which is provided at a lower end of the axial component portion and which holds a circuit component(842), a holder-holding movable member (762) which holds the circumference portion of the component holder such that thecomponent holder is movable in an axis direction thereof, and a spherical cam follower (804) which is rotatable in all directions.
26