Patent
Edge-emitting light-emitting semiconductor device and method of manufacture thereof
Takehiro Fujii
- 23 Apr 2001
53
TL;DR: In this article, an edge-emitting light emitting semiconductor (LED) device with an opaque and reflective case is described, and the case is filled with transparent resin to mold the LED chip.
read more
Abstract: An edge-emitting light-emitting semiconductor device (10) includes a substrate (12) provided with an opaque and reflective resin case (14). Electrodes (18a, 18b) are formed on the surface of the substrate (12), and the electrodes (18a, 18b) are bonded to an LED chip. Transparent resin (16) is filled between the substrate (12) and the case (14) to mold the LED chip (20). The light-emitting edge of the semiconductor device (10) includes a face opposed to the sides (16a, 16b, 16b) formed of the transparent resin (16). The light-emitting edge has a roughened surface to scatter the light from the LED chip and the light reflected by the case (14).
read more
Chat with Paper
AI Agents for this Paper
Find similar papers on Google Scholar, PubMed and Arxiv
Write a critical review of this paper
Analyze citations of this paper to find unaddressed research gaps
Citations
Patent
Light emitting diode package
Jun Yong Park,Suh Dae Woong,Bo Ram I Jang,Hee Cheul Jung,Kyu Ho Lee,Chang Hoon Kim +5 more
- 28 Mar 2008
TL;DR: In this paper, a light-emitting diode package is described, consisting of a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in serial with each other, and a fluorescent body for converting the wavelength of light emitted by the light emitting diodes.
553
Patent
Semiconductor Light Emitting Device
Yukio Shakuda,Toshio Nishida,Masayuki Sonobe +2 more
- 12 Sep 2005
TL;DR: In this article, the authors present a semiconductor light emitting device, consisting of a plurality of semiconductor layers, including a first semiconductor layer having a first conductivity, an active layer interposed between the first and the second semiconductors, and a non-conductive distributed bragg reflector coupled to the plurality of layers, reflecting the light from the active layer.
333
Patent
Optical devices featuring textured semiconductor layers
Theodore D. Moustakas,J. Cabalu +1 more
- 15 Apr 2005
TL;DR: In this paper, the texturing in the region of the quantum well layers greatly enhances internal quantum efficiency if the semiconductor is polar and the quantum wells are grown along the polar direction.
183
Patent
Light-emitting diode
Koichi Fukasawa,Junji Miyashita,Kousuke Tsuchiya +2 more
- 02 Feb 2011
TL;DR: In this paper, a light-emitting diode element (29) formed of semiconducting nitride gallium on a transparent sapphire glass substrate is fixedly attached to the transparent resin with transparent adhesive.
178
Patent
Method transparent member, optical device using transparent member and method of manufacturing optical device
Takeshi Ashida
- 27 Jun 2008
TL;DR: In this article, a method of manufacturing an optical device is presented, in which a whole substrate is first prepared which has a plurality of regions corresponding to substrates constituting a pluralityof optical devices, respectively.
84
References
Patent
Compact light-emitting device with sealing member and light-transmitting resin seal
Jun Okazaki
- 01 Dec 1995
TL;DR: In this paper, a plurality of through holes are formed on an insulating substrate, and the following components and members are provided: LED chips, each of which consists of a p-side semiconductor layer and an n-side polysilicon layer that are joined into a pn junction, and is placed between the adjacent through holes.
35
Patent
Light-emitting device
Oota Kiyohisa
- 25 Jan 2000
TL;DR: In this article, a horizontally mounted LED chip is mounted in a horizontal state in such a manner that a PN junction surface is in perpendicular to a unit substrate, and an electrical connection to the LED chip 41 is performed by connecting thick film electrodes 53, 54 provided on both sides in a perpendicular direction to a junction surface, and the wiring patterns 46, 47 on the unit substrate 45 to each other through electrically conductive pastes 56, 57.
25
Patent
Chip-type semiconductor light emitting device
Hiroki Ishinaga
- 27 Apr 2000
TL;DR: In this paper, a rectangle-shaped insulation substrate is provided, and a light emitting element chip is provided in such a manner that the portion of the light transmitting member is not covered over from a one side to at least a part of the side portions (B) and on both sides connected to the side portion (A).
23
Patent
Semiconductor integrated circuit mounting board
Hiromi Fuchida,Toshio Sudo,裕美 渕田,俊夫 須藤 +3 more
- 30 Jul 1991
TL;DR: In this paper, the authors propose to provide a semiconductor integrated circuit mounting board of high reliability where power supply noises are restrained in high speed switching operation, and the integrated circuits and discrete components are highly integrated and densely mounted.
19
Patent
Side-emission chip led
Shiyuuzou Abe,Atsushi Okazaki,淳 岡崎,宗造 阿部 +3 more
- 22 Oct 1996
TL;DR: In this article, a side-emission chip LED which is wide in a horizontal effective irradiation region and high in brightness is provided, where a light emitting element 41 mounted on a base 40 is sealed up in a light transmitting body 42, and a reflector 43 which reflects light emitted from the elements 41 is provided covering a part of the surface of the light transmission body 42.
17
Related Papers (5)
Ban P. Loh
- 02 Sep 2003
Hsing Chen
- 11 Oct 2001
Jerome Chandra Bhat,Daniel A. Steigerwald,Reena Khare +2 more
- 15 May 2001
Joseph B. Mazzochette,Greg E. Blonder +1 more
- 26 Apr 2004