Patent
Correction Die for Wafer/Die Stack
Belgacem Haba
- 29 Feb 2016
7
TL;DR: In this paper, a dummy die can be coupled to other die stacks of a wafer-to-wafer stack to adjust a height of the stacks to compensate for a defective die.
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Abstract: Representative implementations of devices and techniques provide correction for a defective die in a wafer-to-wafer stack or a die stack. A correction die is coupled to a die of the stack with the defective die. The correction die electrically replaces the defective die. Optionally, a dummy die can be coupled to other die stacks of a wafer-to-wafer stack to adjust a height of the stacks.
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Citations
Patent
Increased contact alignment tolerance for direct bonding
Paul M. Enquist,Gaius Gillman Fountain,Delacruz Javier A +2 more
- 15 Dec 2016
TL;DR: In this paper, the authors propose a contact-bonded interface between the first and second set of contact structures formed by contact bonding of the first nonmetallic region to the second non-metallic regions.
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Cyprian Emeka Uzoh,Paul M. Enquist,Gaius Gillman Fountain +2 more
- 22 Dec 2016
TL;DR: In this paper, a film which supports a plurality of diced integrated device dies can be provided, and a force can be applied in a direction nonparallel to the surface of the film to cause the selected first die to be directly transferred from the surface to the support structure.
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Cyprian Emeka Uzoh,Arkalgud R. Sitaram,Paul M. Enquist +2 more
- 19 May 2016
TL;DR: In this paper, a method for forming a bonded structure is disclosed, which can comprise mounting a first integrated device die to a carrier, and after mounting, the first device die can be thinned.
13
Patent
Interface structures and methods for forming same
Shaowu Huang,Delacruz Javier A +1 more
- 19 Sep 2017
TL;DR: In this paper, a stacked and electrically interconnected structure is described, where a first element comprises a first contact pad and a second element comprising a second contact pad, which can be electrically and mechanically connected to one another by an interface structure.
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Patent
Chemical mechanical polishing for hybrid bonding
Gaius Gillman Fountain,Chandrasekhar Mandalapu,Cyprian Emeka Uzoh,Jeremy Theil +3 more
- 17 Sep 2018
TL;DR: In this paper, chemical mechanical polishing for hybrid bonding has been used to reveal a bonding surface on or at the dielectric layer of a substrate, and the conductive structure is polished with a selective polish.
6
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Patent
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