Patent
Chip type solid electrolytic capacitor having plated fillet surface and method of manufacturing the same
Satoshi Abe,Masami Ishijima +1 more
- 15 Dec 2004
21
TL;DR: In this article, an anode terminal is provided with a lower surface exposed from a package lower surface and an end surface adjacent to the anode terminals lower surface, exposed from the first package end surface.
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Abstract: In a chip type solid electrolytic capacitor, an anode terminal is provided with an anode terminal lower surface exposed from a package lower surface and an anode terminal end surface adjacent to the anode terminal lower surface and exposed from a first package end surface. The cathode terminal is also provided with a cathode terminal lower surface and a cathode terminal end surface. The anode terminal end surface is provided with an anode terminal dent surface upwardly extending from the boundary with the anode terminal lower surface. The anode terminal dent surface is plated. The cathode terminal end surface is also provided with a cathode terminal dent surface which is plated.
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Citations
Patent
Solid electrolytic capacitor
Yanming Liu,Yuji Yoshida,Hayato Ueda,Daisuke Takada,Satoshi Iwai,Takashi Mizukoshi +5 more
- 08 Dec 2008
TL;DR: An outer insulation member made of a first resin packed a part of an anode terminal has a predetermined section as mentioned in this paper, which consists of a front surface, a back surface and edges connecting between the front surface and the back surface.
258
Patent
Solid Electrolytic Capacitor Assembly
Ivana Zednickova
- 12 Aug 2010
TL;DR: In this article, a capacitor assembly that includes an anode body, a dielectric overlying the anode, and a solid electrolyte (e.g., conductive polymer) overlying a polysilicon-coated core is provided.
27
Patent
Method of improving cathode connection integrity in solid electrolytic capacitors using secondary adhesive
Antony Chacko
- 04 Aug 2006
TL;DR: In this paper, a solid electrolytic capacitor body is attached to lead frame by a secondary adhesive and a method for forming the capacitor assembly consists of a chip that has conductive adhesive formed on the cathode surface.
14
Patent
Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors
Antony P. Chacko,John E. McConnell,Philip M. Lessner,Randolph S. Hahn,John Bultitude +4 more
- 26 May 2011
TL;DR: In this paper, a solid electrolytic capacitor with an anode and a dielectric on the anode is described, where a cathode is electrically connected to the conductive coating by an adhesive selected from the group consisting of a transient liquid phase sinterable material and polymer solder.
12
Patent
Chip type solid electrolytic capacitor having a small size and a simple structure
Mitsunori Sano,Takashi Kono,Makoto Tsutsui +2 more
- 13 Jan 2004
TL;DR: In this article, a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface.
12
References
Patent
Solid electrolytic capacitor and method of making the same
Masahide Maeda
- 27 Jun 2003
TL;DR: A solid electrolytic capacitor includes a capacitor element having an element body and an anode wire extending from the element body to the upper surface of the cathode lead, and a resin package integrally sealing these parts as mentioned in this paper.
53
Patent
Chip capacitor and method of manufacturing same
Mitsunori Sano,Takashi Kono +1 more
- 08 May 2002
TL;DR: In this paper, a chip capacitor has capacitor component 14 having anode lead 17 and sintered body 21 of a metal having a valve action in which anode leads 17 is embedded so as to project from embedding surface 21 a.
45
Patent
Electronic component and manufacture thereof, and lead frame and mold used in manufacture thereof
Takada Hirofumi,Tanida Tadashi +1 more
- 18 Nov 1997
TL;DR: In this article, the problem of providing an electronic component of a resin-sealed package which realizes high-density packaging on a printed circuit board and avoids transformation of a lead upon packaging is addressed.
15
Patent
Solid electrolytic capacitor and method for manufacturing the same
Tomohide Wada,Katsuyuki Nakamura +1 more
- 18 Mar 2003
TL;DR: In this article, a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element.
13