Chip silicon processing method

TL;DR: In this article, the authors present a chip silicon processing method that can guarantee that the chip silicon is reasonable in layout inuse, can achieve the accurate connection with the parts, and is simple in preparation mode.

Abstract: The invention belongs to the field of chip silicon processing, particularly relates to a chip silicon processing method. In view of the problem that components are inconvenient to accurately connect after the existing chip silicon is produced, the method in the scheme comprises the following steps of: S1, refining the silicon by using quartz sand and purifying the silicon, S2, preparing a siliconcrystal bar from the purified silicon and slicing the silicon crystal bar to obtain a wafer, S3, preparing a silicon wafer after the wafer is subjected to film coating, photoetching development, etching and impurity mixing, S4, scanning the size information of the prepared silicon wafer to a computer for modeling, marking the positions of parts needing to be installed on the silicon wafer, and reasonably analyzing the positions of the parts, and S5, recording the marked data when the position data meet the requirements. The method can guarantee that the chip silicon is reasonable in layout inuse, can achieve the accurate connection with the parts, and is simple in preparation mode.