Patent
Apparatus for stacking substrates and method for the same
Isao Sugaya,Kazuya Okamoto,Mitsuishi Hajime,Fukuda Minoru +3 more
- 11 Oct 2019
2
TL;DR: In this paper, a substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate holding by a second holding section contact each other is described.
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Abstract: A substrate stacking apparatus that stacks first and second substrates on each other, by forming a contact region where the first substrate held by a first holding section and the second substrate held by a second holding section contact each other, at one portion of the first and second substrates, and expanding the contact region from the one portion by releasing holding of the first substrate by the first holding section, wherein an amount of deformation occurring in a plurality of directions at least in the first substrate differs when the contact region expands, and the substrate stacking apparatus includes a restricting section that restricts misalignment between the first and second substrates caused by a difference in the amount of deformation. In the substrate stacking apparatus above, the restricting section may restrict the misalignment such that an amount of the misalignment is less than or equal to a prescribed value.
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Citations
Patent
Machining object cutting method and machining object cutting device
Okuma Junji,Sugimoto Yo +1 more
- 23 Feb 2017
TL;DR: A machining object cutting method consisting of a crystal orientation identification step, a planned cutting line setting step, and a cutting step in which the object to be machined is cut along the planned cut line is described in this article.
2
Patent
Method for aligning substrates before bonding
Dragoi Viorel
- 24 May 2018
TL;DR: In this article, the authors proposed a method for aligning a first substrate (7) having at least two first alignment marks (8) with a second substrate (8), having at most two second alignment marks(9, 9'), by means of the first and second characteristic alignment features (9 and 9').
2
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TL;DR: A microelectronic package as discussed by the authors includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the micro-electronic element, whereby at least one of the posts is disposed in the outer region of a substrate.
383
Patent
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Norio Fukasawa,Toshimi Kawahara,Muneharu Morioka,Mitsunada Osawa,Yasuhiro Shinma,Hirohisa Matsuki,Masanori Onodera,Junichi Kasai,Shigeyuki Maruyama,Masao Sakuma,Yoshimi Suzuki,Masashi Takenaka +11 more
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TL;DR: In this paper, a method for manufacturing semiconductor devices includes a resin sealing step of putting a substrate (16) on which bumps (12) and a plurality of semiconductor chips (11) are arranged in the cavity of a mold and supplying a resin (35) to the region where the bumps are provided so as to coat the bumps and form a resin layer.
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Patent
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Thomas Wagenleitner,Markus Wimplinger,Paul Lindner,Thomas Plach,Florian Kurz +4 more
- 29 May 2013
TL;DR: In this article, a method for bonding a first substrate (3) to a second substrate (8) at contact surfaces (3k, 8k) of the substrates (3, 8), having the following steps, in particular in the following sequence, was described.
30
Patent
Method for molecular adhesion bonding with compensation for radial misalignment
Gweltaz Gaudin
- 04 Oct 2010
TL;DR: In this article, a method for bonding a first wafer on a second wafer by molecular adhesion, where the wafers have an initial radial misalignment between them, was proposed.
26
Patent
Temperature control system
Joseph George Land
- 22 Jul 2013
TL;DR: An HVAC system controller has at least one processor that is configured to calculate an environmental metric, and configure to determine whether mixing the first air volume with the second air volume can cause the environmental metric to conform to a first threshold requirement.
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