Owing to their outstanding comprehensive performance, polyimide (PI) composite films are widely used on the external surfaces of spacecraft to protect them from the adverse conditions of low Earth orbit (LEO). However, current PI composite films have inadequate mechanical properties and atomic oxygen (AO) resistance. Herein, this work fabricates a new PI-based nanocomposite film with greatly enhanced mechanical properties and AO resistance by integrating mica nanosheets with PI into a unique double-layer nacre-inspired structure with a much higher density of mica nanosheets in the top layer. In addition, the unique microstructure and the intrinsic properties of mica also impart the nanocomposite film with favorable ultraviolet and high-temperature resistance. The comprehensive performance of this material is superior to those of pure PI, single-layer PI-mica, and previously reported PI-based composite films. Thus, the double-layer nanocomposite film displays great potential as an aerospace material for use in LEO.

Double-Layer Nacre-Inspired Polyimide-Mica Nanocomposite Films with Excellent Mechanical Stability for LEO Environmental Conditions.

A multiple synergistic composite coating with ultrahigh anti-corrosion performance under harsh oxygen environment

With the advent of the 5 G era, advanced packaging applications such as wafer-level fan-out packaging have emerged thanks to efforts to reduce signal loss and increase signal transmission rates. As one of the key materials employed in telecommunication devices, the interlayer dielectric material directly affects signal transmission and device reliability. Among them, polyimide (PI) has become an important interlayer dielectric material because of its excellent comprehensive properties. However, in order to meet the needs high-frequency and high-speed circuits for 5 G networks, it will be necessary to further reduce the dielectric constant and dielectric loss of PI. PI is widely used as a flexible dielectric material due to its excellent electrical insulation properties (dielectric constant ≈ 3.0–4.0, dielectric loss ≈ 0.02), mechanical properties, and thermal resistance. However, further reduction in the dielectric constant will be needed in order for PI-based materials to better meet the current high integration development needs of the microelectronics industry. This article starts from strategies to prepare low dielectric PI that have been developed in the last decade, based on a more systematic and inductive analysis, and prospects the development potential of low dielectric PI. 

Synthesis and Applications of Low Dielectric Polyimide

High-strength and high-temperature-resistant multilayer interconnected polyimide paper derived from anisotropic aerogel via a hot-extrusion strategy for aerospace applications

Despite polyimide (PI) has been regarded as heat-resistant aviation material, but its high friction coefficient and insufficient abrasion resistance hinder the wide application. Herein, a versatile PDMS-PI composite coating with double-layer structure was prepared by crosslinking hybrid. The effect of polydimethylsiloxane (PDMS) on the hydrophobic, heat-resistant and tribological properties of PDMS-PI composite coating was explored. As expected, compared with the PI and SiO2-PI, PDMS-PI coating achieved the contact angle of 108.5° and only 5 wt% heat loss temperature at 578 ℃. Additionally, its wear rate obviously decreased by 38.5 %, and the friction coefficient declined from 0.33 to 0.07. The improvement contributes to excellent hydrophobic and heat resistance of dense protective layer and low-friction/wear of the PDMS coating layer. 

PDMS-PI composite coating toward multi-purpose development: Hydrophobic, low-friction/wear, and heat-resistance

To make clear the effect and mechanism of sericite mica (SM) modified by silane coupling agents (SCA) on the morphology and properties of polyimide (PI) composites, the SM modified by different SCA including 3-aminopropyltriethoxysilane (KH550), 3-glycidoxypropyltrimethoxysilane (KH560) and 3-methacryloxypropyltrimethoxysilane (KH570), respectively, with equal grafting rate was prepared and used to prepare a series of PI/SM composites with the same SM content (5.0 wt%) by in situ polymerization. The effects of different SCA on the structure and properties of PI composites were studied by means of FT-IR, XRD, SEM, X-ray photoelectron spectroscopy, TGA, tensile and dielectric tests, and their influence mechanism was analyzed. The results showed two-phase interfacial adhesion between KH550-SM and PI matrix was the strongest. PI/KH550-SM composite exhibited the best excellent thermal and mechanical properties, the lowest dielectric constant and loss. The investigation would be of great value for improving the interfacial effects between SM and PI matrix and developing PI composites in relevant application areas.

A comparative investigation on different silane coupling agents modified sericite mica/polyimide composites prepared by in situ polymerization

In order to obtain polyimide composites with ultra-low dielectric constant, a series of MDA-BAPP-BTDA copolyimides/18-crown ether-6 (CPI/18-CE) supramolecular films with inclusion structure were prepared. The effects of 18-CE on CPI's thermal, mechanical, dielectric and water absorption properties were investigated. The inclusion rate of 18-CE to CPI backbone was ~50%. The introduction of 18-CE slightly reduced the thermal properties of CPI/18-CE supramolecular films, but greatly improved their mechanical, dielectric and hydrophobic properties. The tensile strength, young's modulus and elongation at break of CPI/18-CE supramolecular films were maximally increased by 21.8%, 34.1% and 92.9% respectively. Meanwhile their dielectric constant, dielectric loss and water absorption were as low as 2.10, 0.007 and 0.63%, respectively. In summary, CPI/18-CE supramolecular films possess excellent dielectric properties and broad application prospect in the field of microelectronics.

Preparation and properties of MDA-BAPP-BTDA copolyimide/18-crown ether-6 supramolecular films with inclusion structure and ultralow dielectric constants

Preparation and characterization of quaternary ammonium salt and 3-aminopropyltriethoxysilane-modified sericite mica

In this study, modified sericite is used to improve the bonding performance of polyimide(PI) adhesives which owe to its high temperature resistance, corrosion resistance and low cost. In order to f...

Structure and properties of polyimide/sericite composite adhesive prepared bypolyamide acid salt method

Popular Tasks used by Researchers

How can I help with your research?

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

We encountered an error while loading the panel. Please try refreshing the page.

Something went wrong

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

Anyone with the link can view this chat. You can switch it back to private anytime.

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

Yu Xiang

Author Tools

Chat about Author

Papers

A comparative investigation on different silane coupling agents modified sericite mica/polyimide composites prepared by in situ polymerization

Preparation and properties of MDA-BAPP-BTDA copolyimide/18-crown ether-6 supramolecular films with inclusion structure and ultralow dielectric constants

Preparation and characterization of quaternary ammonium salt and 3-aminopropyltriethoxysilane-modified sericite mica

Structure and properties of polyimide/sericite composite adhesive prepared bypolyamide acid salt method