A substrate processing apparatus includes a first processing module including a first processing module, a second processing module, a first utility system adjacent to a back surface of the first processing module, and a second utility system adjacent to a back surface of the second processing module, a first exhaust box of the first utility system and a second exhaust box of the second utility system being disposed to face each other across a maintenance area located behind a part of the back surface of the first processing module that is close to the second processing module and behind a part of the back surface of the second processing module that is close to the first processing module, and a first supply box of the first utility system and a second supply box of the second utility system being disposed to face each other across the maintenance area.

Substrate processing device, method for manufacturing semiconductor device and recording medium

A substrate processing apparatus includes: a processing gas supply pipe configured to supply a processing gas into a processing chamber; a substrate mounting table that is installed in the processing chamber and on which a substrate to be processed is mounted; a driving unit configured to drive the substrate mounting table to move the substrate mounted on the substrate mounting table; a first plasma generating unit configured to generate plasma of the processing gas supplied into the processing chamber with a first density; and a second plasma generating unit that is installed adjacent to the first plasma generating unit in a traveling direction of the substrate and configured to generate plasma of the processing gas supplied into the processing chamber with a second density lower than the first density.

Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium

The invention discloses an electric heating furnace and a temperature control system thereof which are used for material mechanical performance tests, and relates to the field of material performance tests. The electric heating furnace comprises a 150-300 W electric heating furnace body, a 0-500 DEG C temperature controller, a power line and the like. The electric heating furnace body is fixed to lifting supports through fastening screws and is flexibly adjustable in height. The electric heating furnace and the temperature control system thereof can be used for tensile strength tests and croop property tests of metal material samples at the constant temperature of 25-500 DEG C, and can also be used for tensile strength tests of high molecular material samples at the constant temperature of 25-250 DEG C. The electric heating device is not limited by the shapes and sizes of tensile samples and types of material testing machines, and has the characteristics of being wide in application range, good in universality, simple in manufacturing and low in manufacturing cost.

Electric heating furnace and temperature control system thereof

An apparatus, method and integrated circuit for broad-range current measurement using duty cycling are disclosed. Embodiments of an apparatus for sensing current through a transistor device may include an interface configured to receive a current from the transistor device for sensing. Additionally, embodiments may include a sensor component coupled to the interface and configured to receive the current from the transistor device and to generate a responsive sensor voltage. Embodiments may also include a sense control circuit configured to control a duty cycle of the sensor component.

Broad-range current measurement using duty cycling

The present invention addresses the problem of providing a muffle structure for a cylindrical furnace (including a vertical cylindrical furnace and a horizontal cylindrical furnace), the muffle structure having high durability and small thermal capacity, and making it possible to reduce operating cost significantly without requiring a large-size manufacturing facility. The cylindrical furnace muffle structure has a polygonal columnar body comprising a plurality of plate members made of carbon/carbon composite material and a plurality of linking members made of carbon/carbon composite material, wherein the plurality of plate members are coupled by means of the plurality of linking members.

Cylindrical furnace muffle structure made of carbon/carbon composite material

PROBLEM TO BE SOLVED: To easily adjust high-temperature air flow in a thermal treatment device.SOLUTION: A thermal treatment device 1 includes a passage 15, a shutter member 8, and an operation device 9. The passage 15 can pass heated gas. The shutter member 8 is provided for adjusting air flow A1 passing through the passage 15 toward a treatment chamber 5 capable of arranging an object 200 to be treated. The operation device 9 is provided for operating the shutter member 8 from the outside of the passage 15.

Thermal treatment device

PROBLEM TO BE SOLVED: To allow for arrangement of the nozzle, for supplying the heat treatment gas to a processed object, closer to a processed object in a heat treatment apparatus.SOLUTION: A heat treatment apparatus 1 has an outer tube 4, a boat 11, a closing member 14, and a gas supply device 10. The boat 11 holds a processed object 100, and can enter the outer tube 4 or exit therefrom. The closing member 14 is provided for closing the lower end 4b of the outer tube, and can move in the vertical direction X1 accompany with the boat 11. The gas supply device 10 supplies the heat treatment gas to the processed object 100 in the outer tube 4. The movable section 28 of the gas supply device 10 can move in the vertical direction X1 accompany with the closing member 14. The nozzle sections 37, 38 of the movable section 28 supply the heat treatment gas to the processed object 100.

Heat treatment apparatus

PROBLEM TO BE SOLVED: To reduce labor required for manufacture, even in the case of a large-type chamber for thermal treatment equipment.SOLUTION: A chamber 4 for thermal treatment equipment 1 includes a cylindrical side wall 12 for surrounding an article to be treated, and an end wall 13 for closing one opening 12b of the side wall 12. In the chamber 4, a plurality of members (a side wall 12, an end wall 13, a first connection member 14, and a second connection member 15) predominantly composed of a silicon oxide are formed by being mechanically connected together.

Chamber for thermal treatment equipment, and thermal treatment equipment

PROBLEM TO BE SOLVED: To provide a shutter device of a vertical heat treatment furnace capable of reducing the weight of a shutter while suppressing thermal deformation.SOLUTION: A shutter device 23 of a vertical heat treatment furnace 10 is equipped with a shutter 25 that opens/closes an opening provided to a lower end of a furnace body 11, and a drive mechanism 24 which drives opening/closing of the shutter 25. A recessed part 33 is formed at a portion of the shutter 25 that corresponds to the central part of the furnace body 11, the recessed part being so recessed as to come away from the inside of the furnace body 11 for suppressing thermal deformation of the shutter 25.

Shutter device of vertical heat treatment furnace

PROBLEM TO BE SOLVED: To provide a gas detecting apparatus which suppresses its malfunction, has a long life and monitors an exhaust gas while maintaining a process efficiency of an oxynitriding process step, and also to provide an oxynitriding process facility equipped with the same. SOLUTION: The gas detecting apparatus 30 of the oxynitriding process facility 1 used for manufacturing a semiconductor includes: a dilution gas channel 33 for conveying a dilution gas for diluting the exhaust gas; and a mixed gas channel 35 for mixing the dilution gas and the exhaust gas exhausted from a process furnace 10, and for generating a mixed gas. Thus, the exhaust gas is diluted by the dilution gas, and an amount of a nitrogen oxide and a nitric acid gas which are introduced for a fixed period into a sensor section 36 for detecting the nitrogen oxide, is reduced, thereby suppressing the malfunction of the gas detecting apparatus, extending the life, and enabling the exhaust gas to be monitored while maintaining the process efficiency of the oxynitriding process step. COPYRIGHT: (C)2010,JPO&INPIT

Gas detecting apparatus and oxynitriding process facility equipped with the same

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義彦浦崎

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Thermal treatment device

Heat treatment apparatus

Chamber for thermal treatment equipment, and thermal treatment equipment

Shutter device of vertical heat treatment furnace

Gas detecting apparatus and oxynitriding process facility equipped with the same

義彦 浦崎

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Chat about Author

Papers

Thermal treatment device

Heat treatment apparatus

Chamber for thermal treatment equipment, and thermal treatment equipment

Shutter device of vertical heat treatment furnace

Gas detecting apparatus and oxynitriding process facility equipped with the same

義彦浦崎