A cooling system (26) comprising a cooling arrangement (24, 24', 24") having a serpentine passageway (20) for a circulating fluid coolant is disclosed. The serpentine passageway (20) is provided between a plurality of walls (6, 8) displaced from each other. A series of baffles (10) each having a proximal portion (12) and a distal portion (14) are disposed within the passageway (20). The baffles (10) extend from one of the walls into the passageway (20). The distal portion (14) has a width (W2) that is larger than the width (W1) of the proximal portion (12).

Cooling system comprising a serpentine passageway

Verfahren zur Herstellung eines Kuhlelements (1) fur ein elektrisches oder elektronisches Bauteil, insbesondere ein Halbleiterelement, wobei das gefertigte Kuhlelement (1) ein Kuhlfluidkanalsystem aufweist, durch das im Betrieb ein Kuhlfluid durchleitbar ist, umfassend- Bereitstellen mindestens einer ersten Metallschicht (11)- Realisieren mindestens einer Ausnehmungen (21, 22) in der mindestens einen ersten Metallschicht (11), und- Ausbilden zumindest eines Teilabschnitts des Kuhlfluidkanalsystem mittels der mindestens einen Ausnehmung (21, 22),wobei mindestens ein erster Teil (21) der mindestens einen Ausnehmung (21, 22) in der mindestens ersten Metallschicht (11) durch Erodieren, insbesondere Funkenerodieren, realisiert wird.

Verfahren zur Herstellung eines Kühlelements und Kühlelement hergestellt mit einem solchen Verfahren

Die Erfindung betrifft ein Leistungselektroniksystem (1) umfassend mindestens ein Leistungselektronikmodul (2). Das Leistungselektronikmodul (2) umfasst eine Grundplatte (3) und mindestens eine warmeerzeugende Komponente, die auf einer ersten Seite der Grundplatte (3) angeordnet ist. Das Leistungselektronikmodul (2) umfasst eine Kuhlstruktur (4), um Warme vom Leistungselektronikmodul (2) weg zu transportieren uber ein Kuhlmittel, das durch die Kuhlstruktur (4) geleitet wird. Die Kuhlstruktur (4) ist auf einer zweiten Seite (5) der Grundplatte (3) gegenuber der ersten Seite angeordnet.Aufgabe der Erfindung ist es, ein Leistungselektroniksystem (1) mit einer verbesserten Kuhlung bereitzustellen.Gemas der vorliegenden Erfindung wird diese Aufgabe dadurch gelost, dass die Kuhlstruktur (4) einstuckig mit der Grundplatte (3) ausgebildet ist.

Leistungselektroniksystem und Verfahren zu dessen Herstellung

The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Electronic power system and method for manufacturing the same

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Leistungselektroniksystem und Verfahren zu dessen Herstellung

Electronic power system and method for manufacturing the same