Wang Kun

TL;DR: In this paper, a thermosensitive chip for a composite electrode, comprising a thermensitive substrate, where each of the two surfaces of the substrate is sequentially provided thereon with a silver electrode and a gold electrode from the inside to the outside in a stacked manner.

TL;DR: In this article, a combined electrode thermosensitive chip is proposed, where the gold electrodes on the outer surfaces are convenient for better gold wire binding, while the silver electrodes are placed on the bottom surfaces of gold electrodes to reduce the manufacturing cost.

TL;DR: In this article, a packing method of thermistors chips based on tray arrangement was proposed, where the thermistors were placed in a tray to be arranged, and the packing process was performed on a blue film.