Tsai Chia-Chun
2 Papers
35 Citations
Tsai Chia-Chun is an academic researcher. The author has contributed to research in topics: Chip-scale package & Embedded Wafer Level Ball Grid Array. The author has an hindex of 1, co-authored 2 publications.
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Papers
•Journal Article
A New Approach to the Ball Grid Array Package Routing
TL;DR: A ring-based router for the BGA package is presented in this paper to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area to generate an even distribution of planar and any-angle wires to improve manufacturing yield.
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