A glass-ceramic composition contains first ceramic particles principally containing forsterite; second ceramic particles principally containing at least one selected from the group consisting of calcium titanate, strontium titanate, and titanium oxide; and borosilicate glass particles containing about 3% to 15% lithium oxide, about 20% to 50% magnesium oxide, about 15% to 30% boron oxide, about 10% to 45% silicon oxide, about 6% to 20% zinc oxide, 0% to about 15% aluminum oxide, and at least one additive selected from the group consisting of calcium oxide, barium oxide, and strontium oxide on a weight basis. The content of the borosilicate glass particles is about 3% or more; the lower limit of the content of the additive is about 2%; and the upper limit of the additive content is about 15%, about 25%, or about 25% when the additive is calcium oxide, barium oxide, or strontium oxide, respectively, on a weight basis.

Glass ceramic composition, glass-ceramic sintered body, and monolithic ceramic electronic component

Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Epitaxial formation support structures and associated methods

Disclosed is an insulating ceramic composition for insulating ceramic layers (3) laminated in a multilayer ceramic substrate (2) for multilayer ceramic electronic components such as a ceramic multilayer module (1). The insulating ceramic composition contains a first ceramic powder mainly containing forsterite, a second ceramic powder mainly containing at least one selected from CaTiO3, SrTiO3 and TiO2, and a borosilicate glass powder. The borosilicate glass powder contains 3-15 weight% of lithium in terms of Li2O, 30-50 weight% of magnesium in terms of MgO, 15-30 weight% of boron in terms of B2O3, 10-35 weight% of silicon in terms of SiO2, 6-20 weight% of zinc in terms of ZnO, and 0-15 weight% of aluminum in terms of Al2O3. The insulating ceramic composition can be sintered at a temperature not more than 1000˚C, and a sintered body thereof has low relative dielectric constant, low temperature coefficient of resonant frequency and high Q value.

Insulating ceramic composition, insulating ceramic sintered body, and multilayer ceramic electronic component

PROBLEM TO BE SOLVED: To provide a manufacturing method of a lithium ion secondary battery simultaneously calcining a laminate with cathode and anode green sheets pinching an inorganic solid electrolyte green sheet to be integrated, and providing substantially the same effect as calcining in different atmosphere gas for each electrode layer. SOLUTION: The manufacturing method of a lithium ion secondary battery comprises a process for manufacturing the electrolyte green sheet and the cathode green sheet and/or the anode green sheet, a process for manufacturing the laminate made by laminating the electrolyte green sheet, the cathode green sheet and/or the anode green sheet, and a process for sintering the laminate sandwiched by ceramic or metal setters disposed on both sides of the laminate. COPYRIGHT: (C)2009,JPO&INPIT

Manufacturing method of lithium ion secondary battery

A dielectric ceramic composition comprises as a main component, Cu oxide, Si oxide and one selected from the group consisting of Zn oxide alone and a combination of Mg oxide and Zn oxide, as a subcomponent, a glass component including B oxide and at least one selected from the group consisting of Si oxide, Ba oxide, Ca oxide, Sr oxide, Li oxide and Zn oxide, and having a glass softening point is 750° C. or less, wherein a content of said glass component is 1.5 to 15 wt % with respect to 100 wt % of said main component. According to the present invention, a dielectric ceramic composition can be provided which is available to be sintered at low temperature (for example, 950° C. or lower) while comparatively decreasing contents of a glass component, which shows good properties (specific permittivity, loss Q value and insulation resistance), and which is available to perform cofiring different materials.

Dielectric ceramic composition, multilayer complex electronic device, multilayer common mode filter, multilayer ceramic coil and multilayer ceramic capacitor

PROBLEM TO BE SOLVED: To produce low-softening-point glass without essentially comprising PbO and SiO2 , and to obtain a low-temperature-sintering ceramic composition having high Q-value which allows low temperature sintering with low-resistance conductors such as Cu, Ag by combining the glass with ceramics. SOLUTION: The low-temperature-sintering ceramic composition comprises 100 pts.wt. of at least one ceramic powder selected from the group consisting of MgTiO3 , SrTiO3 , CaTiO3 , Mg2 SiO4 , BaTi4 O9 , Al2 O3 , TiO2 , SiO2 , (Mg, Ti)2 (BO4 )O, ZrO2 , and 1-20 pts.wt. of low-softening-point glass comprising 10-30 wt.% of SiO2 , 10-60 wt.% of at least one selected from the group consisting of MgO, CaO, BaO and SrO, 20-50 wt.% of at least one selected from Al2 O3 and B2 O3 , and 0-30 wt.% of at least one selected from the group consisting of Li2 O, Na2 O and K2 O, the sum of the components being 95 wt.% or higher, wherein the glass has a softening point of 600 deg.C or lower.

Low-softening-point glass and method for producing the same, and low-temperature-sintering ceramic composition

PROBLEM TO BE SOLVED: To provide a ceramic circuit board for controlling the formation of a fine uneven surface in the plane direction of the side end of wiring by enhancing a resolution of a fine wiring conductor, and also to provide a manufacturing method for easily obtaining in lower cost the same ceramic circuit board for controlling the formation of fine uneven surface in the plane direction of the side end of the wiring by enhancing the resolution of the fine wiring conductor. SOLUTION: The ceramic circuit board comprises a laminated body formed by laminating a plurality of insulating layers formed of ceramic and a wiring conductor formed on the surface and/or internal side of the insulating layer. When the wiring conductor is projected to the surface of the insulating layer for the surface depth δ of the electromagnetic wave passing through the wiring conductor, the number of projected and recessed regions with depths over 3δ existing at the boundary between the wiring conductor and the insulating layer is equal to five or less for a distance of 30δ in the longitudinal direction. COPYRIGHT: (C)2006,JPO&NCIPI

Ceramic circuit board and manufacturing method thereof

There is provided a dimensionally accurate insulating substrate in which plane direction-wise shrinkage is practically zero and shrinkage variations are small. The insulating substrate includes a laminated body composed of at least two kinds of insulating layers made of crystallizable glass ceramics. The crystallization temperature of crystallizable glass contained in the first insulating layer is lower than the softening point of crystallizable glass contained in the second insulating layer. The difference in thermal expansion coefficient between the first and second insulating layers is preferably 2×10 −6 /° C. or below.

Insulating substrate and manufacturing method therefor, and multilayer wiring board and manufacturing method therefor

PROBLEM TO BE SOLVED: To provide a dielectric porcelain having low dielectric constant, offset temperature of shrinkage close to those of Ag- or Cu-conducting layer, and enabling to be co-fired with a conducting layer comprising Ag or Cu as the main component, and to provide a laminate containing it. SOLUTION: This dielectric porcelain comprises as a main component a composition expressed by (1-x)Mg2SiO4.xMgTiO3, wherein x in mol satisfies an equation 0<=x<=0.8, and comprises 0.1 to 12 pts.wt. of Al as Al2O3, 3 to 20 pts.wt. of B as B2O3, 1 to 10 pts.wt. of Li as Li2CO3, and 1 to 5 pts.wt. of an alkaline earth metal other than Mg as oxide, each to 100 pts.wt. of the main component. This laminate comprises at least one layer of the dielectric porcelain in a dielectric substrate having plural dielectric layers in which a conductive layer comprising as the main component Ag and/or Cu is formed inside and/or on the surface of the substrate.

Dielectric porcelain and laminate

A laminate includes a first green sheet and a second green sheet. The first green sheet includes a first glass including Al and M which is at least one of Sr and Ba. A relationship between Al content and M content is so defined that a position represented by percent by mass of Al in terms of Al2O3 and percent by mass of M in terms of MO on a coordinate system are on or in a range defined by straight lines connecting point A (1, 21), point B (1, 35), point C (9, 45), point D (20, 45), point E (20, 35), and point F (9, 21) on the coordinate system. The second green sheet includes a second glass including Si and B. The first green sheet is integrally laminated with the second green sheet.

Laminate, ceramic substrate and method for making the ceramic substrate

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