Takuya Konno
DuPont
12 Papers
121 Citations
Takuya Konno is an academic researcher from DuPont. The author has contributed to research in topics: Electrode & Solar cell. The author has an hindex of 6, co-authored 12 publications.
Chat about Author
Papers
Patent
Electroconductive thick film composition, electrode, and solar cell formed therefrom
Takuya Konno
- 13 Apr 2006
TL;DR: The electroconductive thick film paste of the present invention is a silver electconductive paste, which includes silver particles, glass particles, and an organic vehicle and is used in an electrode for connecting a back face terminal on the silicon substrate of a solar cell, and is characterized by the fact that the average particle diameter of said silver particles is 3.0-15.0 μm.
47
Patent
Semiconductor device, its manufacturing method, and solar cell
Shoichi Karakida,Takuya Konno,Hiroaki Morikawa,Mitsunori Nakatani,Takahiko Nishida,光徳 中谷,卓哉 今野,昇市 唐木田,浩昭 森川,隆彦 西田 +9 more
- 25 Dec 2002
TL;DR: In this article, a solar cell is formed on an Si substrate 10, and a conductive metal paste material 500 is applied thereon by printing to calcine the same, and the semiconductor device is formed by a CVD method.
16
Patent
Paste for solar cell electrode and solar cell
Takuya Konno,Takashi Kitagaki,Hiroki Kojo +2 more
- 01 Aug 2006
TL;DR: In this paper, a paste for a solar cell light-receiving surface electrode including silver particles, glass frit, resin binder, and thinner, silver particles with a specific surface of 0.20-0.60 m 2 /g are used as the silver particles.
14
Patent
Intermediate transfer body, electrophotographic device using this intermediate transfer body and production of intermediate transfer body
Hitoshi Kakii,Takuya Konno,Mihoko Oda,Masaaki Takenaka,卓哉 今野,美穂子 小田,仁志 柿井,正明 竹中 +7 more
- 21 Oct 1996
TL;DR: In this article, the authors proposed to obtain an intermediate transfer body having excellent durability which does not cause elongation or creep by forming a base layer and a surface layer on the base layer, and forming the base layers of an elastomer and the surface layer of an engineering plastic material.
10
Patent
Connection of semiconductor element
Takuya Konno,Hideya Suganami,卓哉 今野,秀哉 菅浪 +3 more
- 29 Jun 1993
TL;DR: The title connection method for semiconductor element is the method with which a bare IC chip 2, with the first pad 4, is attached to a wiring substrate 1 on which the second pad 3 of wiring pattern is provided.
8