In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects.

Method and apparatus for analyzing defect data and a review system

A chip data providing system is provided. The chip data providing system is equipped with an inspection device for inspecting each chip after processing steps of forming integrated circuits on a plurality chips included in a semiconductor wafer are completed, an inspection server that generates, based on an inspection result, first chip data including information concerning the inspection result of each of the chips, and a chip data providing server that generates, based on the first chip data generated by the inspection server and information concerning an assembly enterprise stored in advance, second chip data in a format suitable for a system of the assembly enterprise that selects and uses the plurality of chips included in the semiconductor wafer, and provides the second chip data to the assembly enterprise.

Chip data providing system and chip data providing server used therefore

A method of managing wafer defects includes inspecting each chip in a wafer to generate a unit of wafer defect raw data, using a server to integrate the unit of wafer defect raw data to generate a unit of wafer defect distribution data for recording positions, types, and sizes of defects, using the server to generate a corresponding drawing file according to the unit wafer defect distribution data to show all kinds of defect distributions, and transmitting the drawing file to a terminal such that terminal users can view the defect distributions without receiving the unit of wafer defect raw data.

Method of Managing Wafer Defects

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Method of Managing Wafer Defects