S Huber
5 Papers
23 Citations
S Huber is an academic researcher. The author has contributed to research in topics: Computer science & Wafer. The author has an hindex of 1, co-authored 1 publications.
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Papers
Self-field effects in NbTi subsize cable-in-conduit conductors
TL;DR: In this paper, five NbTi subsize cable-in-conduit conductors with parametric variations were fabricated and the performance of these conductors tested in the SULTAN test facility and the strand properties including the voltage-current characteristic were compared.
23
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging
TL;DR: In this paper , the first FO-WLP processing steps are investigated in detail by performing extensive thermo-mechanical material characterization, temperature-dependent warpage measurements, and numerical simulations.
13
Numerical simulation of transient thermomechanical ageing effects
M. van Dijk,S Huber,Hans Walter,Olaf Wittler,Martin Schneider-Ramelow +4 more
- 25 Apr 2022
TL;DR: In this article , the authors focus on thermo-oxidative ageing effects of a Radio Frequency (RF) application suitable PCB material and how this effect can be considered transiently in a numerical simulation approach.
2
Analysis of the Impact of Environmental Conditions on the Reliability in 5G PCB Assemblies
Hans Walter,Olaf Wittler,M. van Dijk,S Huber,Julia-Marie-Koszegi,Martin Schneider-Ramelow +5 more
- 11 Sep 2023
TL;DR: Analysis of the impact of environmental conditions on the reliability in 5G PCB assemblies investigates the ageing effects on mmWave 5G PCB assemblies due to thermo-oxidative processes. The combined approach of mechanical and high-frequency analysis allows for a correlation of the degradation in performance with other parameters, definition of a Safe Area of Operation, and estimation of the behaviour of the assembly over its lifetime.
1
Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles
TL;DR: In this paper , the warpage of a panel in the context of fan-out packaging is analyzed and the resulting warpage is characterised temperature dependent using the Projection Moiré technique globally across the complete panel and locally on the scale of few dies.