Nanosphere lithography (NSL) is an inexpensive, simple to implement, inherently parallel, high throughput, materials general nanofabrication technique capable of producing an unexpectedly large variety of nanoparticle structures and well-ordered 2D nanoparticle arrays. This article describes our recent efforts to broaden the scope of NSL to include strategies for the fabrication of several new nanoparticle structural motifs and their characterization by atomic force microscopy. NSL has also been demonstrated to be well-suited to the synthesis of size-tunable noble metal nanoparticles in the 20−1000 nm range. This characteristic of NSL has been especially valuable for investigating the fascinating richness of behavior manifested in size-dependent nanoparticle optics. The use of localized surface plasmon resonance (LSPR) spectroscopy to probe the size-tunable optical properties of Ag nanoparticles and their sensitivity to the local, external dielectric environment (viz., the nanoenvironment) is discussed in...

Nanosphere Lithography: A Versatile Nanofabrication Tool for Studies of Size-Dependent Nanoparticle Optics

The ability to pattern functional polymers at different length scales is important for research fields including cell biology, tissue engineering and medicinal science and the development of optics and electronics. The interest and capabilities of polymer patterning have originated from the abundance of functionalities of polymers and a wide range of applications of the patterns. This paper reviews recent advances in top-down and bottom-up patterning of polymers using photolithography, printing techniques, self-assembly of block copolymers and instability-induced patterning. Finally, challenges and future directions are discussed from the point of view of both applicability and strategies for the surface patterning of polymers.

Patterning surfaces with functional polymers

Nanosphere lithography (NSL) is an inexpensive, inherently parallel, high-throughput, and materials-general nanofabrication technique capable of producing well-ordered 2D periodic particle arrays of nanoparticles. This paper focuses on the synthesis of size-tunable silver nanoparticle arrays by nanosphere lithography and their structural characterization by atomic force microscopy (AFM). The in-plane diameter, a, of Ag nanoparticles was tuned from 21 to 126 nm by systematic variation of the nanosphere diameter, D. Similarly, the out-of-plane height, b, was tuned from 4 to 47 nm by varying the mass thickness, dm, of the Ag overlayer. Experimental measurements of a, b, and interparticle spacing dip of many individual nanoparticles as a function of D and dm were carried out using AFM. These studies show (i) b = dm, (ii) dip accurately corresponds to predictions based on the nanosphere mask geometry, (iii) a, after correction for AFM tip convolution, is governed only by the mask geometry and the standard devi...

Nanosphere Lithography: Size-Tunable Silver Nanoparticle and Surface Cluster Arrays

Rapid thermal conductivity measurement with a hot disk sensor: Part 1. Theoretical considerations

Nanofabrication is playing an ever increasing role in science and technology on the nanometer scale and will soon allow us to build systems of the same complexity as found in nature. Conventional methods that emerged from microelectronics are now used for the fabrication of structures for integrated circuits, microelectro-mechanical systems, microoptics and microanalytical devices. Nonconventional or alternative approaches have changed the way we pattern very fine structures and have brought about a new appreciation of simple and low-cost techniques. We present an overview of some of these methods, paying particular attention to those which enable large-scale production of lithographic patterns. We preface the review with a brief primer on lithography and pattern transfer concepts. After reviewing the various patterning techniques, we discuss some recent application issues in the fields of microelectronics, optoelectronics, magnetism as well as in biology and biochemistry.

Nanofabrication: conventional and nonconventional methods.

Projection photolithography at 157 nm was studied as a possible extension of current 248-nm and planned 193-nm technologies. At 157 nm, lasers are available with ∼8 W average power. Their line width is narrow enough as to enable the use of catadioptric, and maybe all-refractive optics similar to those used at 248 and 193 nm. The practicality of such designs is further enhanced by measurements of calcium fluoride, which show that its absorption is sufficiently small (∼0.004 cm−1) at 157 nm. Binary masks with chromium and chromeless phase shifting masks were fabricated on calcium fluoride as the transparent substrate. Robust photoresists at 157 nm still need to be developed, and they probably will be of the top surface imaging or bilayer type. Indeed, a silylation resist process was shown to have characteristics at 157 nm similar to those at 193 nm. The calcium fluoride based masks were integrated with the silylation process and a home-built, small-field, 0.5-numerical aperture stepper to provide projection printing with features as small as 80 nm. These initial results indicate that 157-nm lithography has the potential to become a manufacturing technology at dimensions well below 100 nm.

Lithography with 157 nm lasers

We have measured the transparencies of a number of candidate resist materials for 157 nm, with an emphasis on determining which chemical platforms would allow resists to be used at maximum thicknesses while meeting requirements for optical density. Although ideal imaging is usually obtained at an optical density between 0.1 and 0.3 and values in excess of 0.5 can often result in nonvertical wall profiles, we chose to arbitrarily choose 0.4 as the maximum tolerable optical density. Using this analysis, our findings show that all existing commercially available resists would need to be <60 nm thick, whereas specialized hydrocarbon resists could be made ∼100 nm thick, and new resists based on hydrofluorocarbons, siloxanes, and/or silsesquioxanes could be engineered to be used in thicknesses approaching 200 nm. We also assess the tradeoff between these thicknesses and what current information exists regarding defects as a function of resist thickness.

Outlook for 157 nm resist design

Projection lithography at 157 nm is a candidate technology for the 100–70 nm generations, and possibly beyond. It would provide an evolutionary extension to the current primary photolithographic processes and components: excimer lasers, refractive optics, and transmissive masks. This article presents data on the transmission of optical materials at 157 nm, the performance of optical coatings, the issues that must be faced by photomasks, and the considerations related to engineering resists at this wavelength.

Critical issues in 157 nm lithography

We have measured the transparencies of a number of a candidate resist materials for 157 nm, with an emphasis on determining which chemical platforms would allow resist to be used at maximum thicknesses while meeting requirements for optical density. Assuming an ideal resist optical density of 0.4, our findings show that all existing commercially available resists would need to be < 90 nm thick, whereas specialized hydrocarbon resists could be made approximately 120 nm thick, and new resists based on hydrofluorocarbons, siloxanes, and/or silsesquioxanes could be engineered to be used in thicknesses approaching 200 nm. We also assess the tradeoff between these thicknesses and what current information exists regarding defects as a function of resist thickness.

Outlook for 157-nm resist design

As lithography is extended to 157 nm, the molecular absorptivity becomes high for most organic polymers. Polymer photochemistry depends on photon absorption, and the higher energy associated with 157 nm light should lead to higher quantum yields of photoproducts. Polymers representative of those commonly employed in 193 or 248 nm resists were selected for this study. A gel permeation chromatography based method was developed to determine quantum yields for chain scission and crosslinking on thin polymers films coated on silicon wafers. This method was applied to determine the ΦS and ΦX of a number of lithographically significant homopolymers and copolymers at both the 157 and 248 nm wavelengths. It was found that polymers containing hydroxystyrene only undergo crosslinking while acrylate and methacrylate polymer only undergo chain scission. The film loss of 157 nm exposed poly-t-butyl acrylate and polymethyl methacrylate was found to be very high and attributed primarily to side chain cleavage of the este...

Polymer photochemistry at advanced optical wavelengths

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