Strategies, advances, and challenges associated with the use of graphene-based nanocomposites for electrochemical biosensors.

Scalable, Robust, Low-Cost, and Highly Thermally Conductive Anisotropic Nanocomposite Films for Safe and Efficient Thermal Management

Abstract Effective thermal management is quite urgent for electronics owing to their ever-growing integration degree, operation frequency and power density, and the main strategy of thermal management is to remove excess energy from electronics to outside by thermal conductive materials. Compared to the conventional thermal management materials, flexible thermally conductive films with high in-plane thermal conductivity, as emerging candidates, have aroused greater interest in the last decade, which show great potential in thermal management applications of next-generation devices. However, a comprehensive review of flexible thermally conductive films is rarely reported. Thus, we review recent advances of both intrinsic polymer films and polymer-based composite films with ultrahigh in-plane thermal conductivity, with deep understandings of heat transfer mechanism, processing methods to enhance thermal conductivity, optimization strategies to reduce interface thermal resistance and their potential applications. Lastly, challenges and opportunities for the future development of flexible thermally conductive films are also discussed. 

/pdf/emerging-flexible-thermally-conductive-films-mechanism-23kvxp96.pdf

Emerging Flexible Thermally Conductive Films: Mechanism, Fabrication, Application

Lithium (Li) metal batteries (LMBs) offer great opportunity for developing high-energy density energy-storage-systems, but the anodes suffer a severe problem of dendrite growth that hinders the practical applications of LMBs. Here, we report a soft BaTiO3 ceramic nanofiber film with excellent ferroelectricity and piezoelectricity that enables one to transverse the dense deposition of Li metal. During Li plating, the strong ferroelectricity reduces the Li-ion concentration gradient near the anode and thus facilitating their uniform deposition. Once squeezed by these Li deposits, the BaTiO3 film generates instantaneous piezo-effect to dynamically change the subsequent Li deposition from vertical to lateral. As a result, Li-Cu cells exhibit reversible plating-stripping processes for over 200 cycles with a high Coulombic efficiency of >98.3%. When pairing with high-voltage LiNi0.8Co0.15Al0.05O2 cathodes, the LMBs can retain >80% capacity in 300 cycles without forming dendrites even under challenging conditions including a high cathode loading of 7.2 mg/cm2, a lean electrolyte amount of 7 μL/mg, and high current rates. The findings point to a promising electromechanical coupling strategy to dynamically adjust dendrite growth for designing Li metal anodes.

Dynamic Regulation of Lithium Dendrite Growth with Electromechanical Coupling Effect of Soft BaTiO3 Ceramic Nanofiber Films.

In recent years, flexible resistive sensors have attracted wide attention as one of the important components of wearable devices. However, it is difficult for most flexible sensors to have high stretchability and high sensitivity at the same time. In this study, the modified multi-walled carbon nanotubes as conductive fillers were filled into waterborne polyurethane to form conductive composites, leading to high stretchability of the sensor (120%). The regular crack structure was designed into the sensor to achieve a high gauge factor (∼2000), and the consistency of the sensor was realized by combining the screen-printing process. In addition, the flexible sensor has a short response time (90 ms), good long-term stability (>1000 cycles), and hysteresis characteristics. Furthermore, the excellent characteristics of the flexible sensor enabled it to have a wide working range for human motion and physiological detection, and the sensor was also successfully applied to Morse Code communication and human motion posture recognition for elder fall alarm. This provides a solution for applications in the field of medical health and human-computer interaction. 

Highly stretchable and sensitive flexible resistive strain sensor based on waterborne polyurethane polymer for wearable electronics

A graphite nanoplatelet-based highly sensitive flexible strain sensor

Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

In future, thermal management will play a crucial role in their design and fabrication, because the rapid development in miniaturization and versatility of electronic devices leads to the huge increase in power density. It is an inevitable trend to develop flexible substrate materials with high thermal conductivity, high heat flux, excellent stability and reliability. In this work, a new flexible print circuit board (G-FPC) containing a graphene film with sandwich structure was fabricated for heat dissipation. Firstly, multi-layer graphene film (M-GF) with 739.56 W m−1 K−1 in-plane thermal conductivity was prepared by high-temperature heat treatment (2900 °C) of GO film followed compression rolling process. Then, as-prepared M-GF and polyimide (PI) film were laminated and hot-pressed to fabricate G-FPC with epoxy resin as adhesive. As-fabricated G-FPC exhibits excellent flexibility, stability, and reliability, whose in-plane thermal conductivity can remain 98%, 81% and 88% after 10000, 15,000 and 20,000 bending times. Moreover, as-fabricated G-FPC has good heat dissipation capacity, which can significantly reduce chip temperature, 10 °C lower than traditional FPC with the power density of 0.42 W/cm2. The G-FPC with sandwich structure of PI/M-GF/PI will have potential applications in the flexible and wearable electronics in future, due to their versatility in heat dissipation, flexibility, stability and electronic interconnection as substrates.

Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure

As the huge demand for a multifunctional electronic device with high performance, an important technology in next-generation electronics is thermal management and there are numerous uses for it in enhancing the reliability and sustainable utilization. In this work, a high thermal conductivity substrate based on graphite nanoplatelets (GNPs)/ polyurethane (PU) nanocomposite film is fabricated. The GNPs’ orientation can be semi-quantitative controlled by balancing the effect of gravity and micro-flow field, which results in a thermal conductivity varies from 38.1 W (m·K)-1 to 19.8 W (m·K)-1 as the orientation rearrangement. Meanwhile, Interfacial thermal resistance is evaluated by the Effective medium theory (EMT) models, which is about 1.76 × 10-6 K m2/W to 2.0 × 10-6 K m2/W at 30 °C. Additionally, the chip fixed to the GNP/PU substrate (38.1 W (m·K)-1) could work under a lower temperature than the commercial polycarbonate substrate. Our method is a promising strategy for thermal management of next-generation electronics devices.

Semi-quantitative orientation control of graphite nanoplatelets in GNP/PU nanocomposite via balancing the effects of gravity and micro-flow field and application in manufacturing heat spreader substrate with excellent thermal conductivity

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A graphite nanoplatelet-based highly sensitive flexible strain sensor

Highly conductive thermal interface materials with vertically aligned graphite-nanoplatelet filler towards: High power density electronic device cooling

Flexible printed circuit board based on graphene/polyimide composites with excellent thermal conductivity and sandwich structure

Semi-quantitative orientation control of graphite nanoplatelets in GNP/PU nanocomposite via balancing the effects of gravity and micro-flow field and application in manufacturing heat spreader substrate with excellent thermal conductivity