PROBLEM TO BE SOLVED: To provide an optical package and the like including a reference pattern for mounting capable of suppressing a reduction in recognition accuracy.SOLUTION: An optical package of the present invention includes a substrate provided with a recess, and a light emitting element and a light receiving element mounted on a bottom part of the recess. The optical package is provided, at the bottom part of the recess, with a reference pattern to be a reference for mounting the light emitting element and the light receiving element. The reference pattern includes straight line parts; each of the straight line parts is arranged opposite to any one of one side of the light emitting element and one side of the light receiving element in planar view; and a length in a longitudinal direction of the straight line part is set to be equal to or longer than a length of any one of the one side.

Optical package, optical unit, optical scanner, and image forming apparatus

A method of manufacturing a light emitting device, the method including: disposing a first semiconductor laser element on a disposition surface of a base member such that a light emission end surface of the first semiconductor laser element is parallel to a first line passing through a pair of alignment marks provided on the base member; and disposing a first light-reflective member on the disposition surface such that a reference line for the first light-reflective member, which serves as an alignment reference in disposing the first light-reflective member, is parallel to a second line that is oblique to the first line at a predetermined angle.

Method of manufacturing light emitting device, light emitting device, and base member

PROBLEM TO BE SOLVED: To provide a sub-mount which is constructed not to easily incur increase in manufacturing costs and reduction in yield or reliability and has an aslant waveguide.SOLUTION: A sub-mount 100 of the present invention is used to fix a semiconductor light-emitting element 10, equipped with a waveguide 11 consisting of a semiconductor material whose axis line is inclined θ(degrees) relative to the normal line of the optical input/output end face and which has a refraction index of n, in place. A first surface 101 on which a semiconductor light-emitting element is installed is provided with a fusion material layer 103 for fixing the semiconductor light-emitting element in place. An alignment mark 107 which can discriminate an angle θ=sin[n*sin(θ)/n], where nis the refraction index of a light passage medium in an outside vicinity of the optical input/output end face of the semiconductor light-emitting element, is formed on the fusion material layer 103.

Sub-mount, sub-mount assembly and sub-mount assembly method

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Sub-mount, sub-mount assembly and sub-mount assembly method