An apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig and by a feature that a solder bump is formed on a pad electrode by heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted sufficiently, and an effect of reducing the possibility that solder particles join together can be expected.

Heater, reflow apparatus, and solder bump forming method and apparatus

An optical disk device is provided that can realize favorable recording/reproduction of signals on/from an optical disk having a plurality of signal planes arranged in proximity to each other. In this optical disk device, a hologram ( 4 ) is divided into n(n≧2) regions Ak(k=1, 2, . . . , n) by a straight line that intersects with an optical axis, and a photodetector ( 7 ) is divided into at least two regions A and A′. Light emitted from a light source ( 1 ) is focused on a signal plane ( 6 a ) or ( 6 b ) included in a plurality of signal planes of the optical disk by an objective lens ( 5 ). Light reflected from a first signal plane ( 6 a ) and light reflected from a second signal plane ( 6 b ) pass through the objective lens ( 5 ) to turn into light beams a and a′, respectively, that enter the hologram ( 4 ). 1st-order diffracted light beams ak and ak′ having a common diffraction optical axis are derived from the light beams a and a′ that have entered the regions Ak of the hologram ( 4 ), respectively, and are projected on the photodetector ( 7 ). Distributions of the 1st-order diffracted light beams ak and ak′ on the photodetector ( 7 ) are approximately inverted with respect to an intersection point of the diffraction optical axis and a detection plane. The 1st-order diffracted light beam ak is approximately within the region A and the 1st-order diffracted light beam ak′ is approximately within the region A′.

Optical disc device

PROBLEM TO BE SOLVED: To provide a module having excellent reliability of characteristics. SOLUTION: The method is provided to manufacture a high-frequency module 21 having: a resin portion 25 mounted on a resin substrate 22 and having a semiconductor element 24 buried therein; and a shield metal film 26 covering a surface of the resin portion 25. The method has: a softening step 71 of placing the resin substrate 22 over a resin tank 63 with the semiconductor element 24 down and softening a resin 25a fed into the resin tank 63 until the resin 25a becomes fluidized; a dipping step 72 of bringing a lower surface of the resin substrate 22 into contact with a liquid surface of the resin 25a; a compression inflow step 73 of forcing the resin 25a to flow in the gap between the resin substrate 22 and semiconductor element 24; a curing step 74 of curing the resin 25a; and a step of forming the shield metal film 26. A metal thin film is formed on the surface of the resin portion 25 by sputtering in the step of forming the shield metal film 26. Residual stress in the resin portion 25 is then reduced and stress of the shield metal film 26 is made small. COPYRIGHT: (C)2011,JPO&INPIT

Method of manufacturing module

When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

Component connecting apparatus

PROBLEM TO BE SOLVED: To provide a manufacturing method that prevents the attachment of excessive solder to an end part of a solar cell, and eliminates cracking, etc. of the solar cell to improve the reliability. SOLUTION: In a method of manufacturing a solar cell module wherein a plurality of solar cells 1 are electrically connected via an interconnection material 120 to manufacture a solar cell module, the solar cells 1 and the interconnection material 120 are laid on top of each other via solder, heat block materials 75 and 76 for preventing an increase in temperature of the interconnection material 120 are disposed at the ends of each solar cell 1, and under this condition, the interconnection material 120 is heated to melt the solder so as to electrically connect the solar cells 1 and the interconnection material 120 by the solder. COPYRIGHT: (C)2011,JPO&INPIT

Method of manufacturing solar cell module

PROBLEM TO BE SOLVED: To recover and remove a vaporized flux from the gaseous emissions. SOLUTION: This device is provided with a corona discharge section 10 for releasing minus ions, by which the vaporized flux 19 in the gaseous emissions is electrified to minus and is attracted to a flux recovering plate 11 electrified to plus. The vaporized flux 19 is thus efficiently recovered and removed from the gaseous emissions.

Method and device for removing flux

PROBLEM TO BE SOLVED: To efficiently enable setting of reflow conditions for managing the respective parts at different temperatures and performing reflow soldering. SOLUTION: A printed circuit board 3 wherein thermocouples 5 for temperature measurement are fixed to many specified measuring positions is inserted in a reflow furnace 1. By a furnace driving control means 2, the reflow furnace 1 is driven, and the temperature at each measuring position is measured with a temperature measuring part 6. The measured result is subjected to data processing by a personal computer, the temperature distribution and the temperature profile on the printed circuit board 3 are displayed on an image screen. By a monitor television 4 and an image picture processing means 8, behavior during reflow is displayed on the image screen, and on the basis of the displayed result, the temperature distribution, the temperature profile and the behavior on necessary parts are grasped. Thereby reflow conditions are so set that the temperature of each part of the printed circuit board 3 becomes a desired value.

Reflow condition setting method and equipment

PROBLEM TO BE SOLVED: To provide a method and device for carrying a substrate that eliminates the need for a connection part for maintaining carry-in spacing, and at the same time can secure specific treatment time for carry-out, by forcibly synchronizing the carrying speed of the substrate near the inlet and outlet of a substrate-treating device with that of the substrate-treating device SOLUTION: When a substrate 5 on a carrying conveyer 1 is transferred while being connected onto a conveyer 4 in a device, the transfer speed of the substrate 5 is forcibly synchronized with that of the conveyer 4 in the device that is slower than the carrying conveyer 1, by a speed synchronization means 8 being provided near the inlet of a substrate-treating device 2 On the other hand, when the substrate 5 on the conveyer 4 in the device is transferred while being connected onto a carry-out conveyer 3, the transfer speed of the substrate 5 is forcibly synchronized with that of the conveyer 4 in the device that is slower than the carrying conveyer 3 by the speed synchronization means 8 being provided near the outlet of a substrate-treating device 2

Method and device for carrying substrate

PROBLEM TO BE SOLVED: To collectively solder electronic components mounted on the whole surface of a printed circuit board, with high reliability, without thermal damaging SOLUTION: One surface of a printed circuit board 1 wherein electronic components are mounted and cream solder is applied to bonding parts is subjected to radiation heating by a panel heater 22 At the same time, from an air outlet 27 of a mask plate 26 installed in a hot air header 25 of a hot air heating means 23, hot air is locally blown against the bonding parts on the one surface of the printed wiring board 1, almost vertically Thereby reflow soldering is performed By commonly using the radiation heating, sure soldering is enabled when the temperature of the hot air is made not to exceed the heat resisting temperature of electronic components

Reflow method and equipment

PROBLEM TO BE SOLVED: To provide a reflowing apparatus for simplifying a temperature profile measuring operation, without impairing an internal unit without exposing a temperature calculator for calculating the measurement temperature of a material to be heated through high temperature by a heater with a high temperature, a method for measuring a reflow temperature and a method for reflowing SOLUTION: This reflowing apparatus comprises a conveyor for conveying an article 8 to be heated such as a printed board, having an electronic component mounted thereon, heaters for heating the article 8, a transfer means 7 for moving an input terminal 8a for inputting temperature measuring information from an output terminal 8ab of a temperature sensor connected to the article 8, in synchronization with a conveying speed of the article 6 on the conveyor 9 for conveying the article 6 from an introducing unit to a discharging unit, and a terminal 10 of a temperature calculator connected to the terminal 8a and disposed at a place where is no effect of the heater

Reflowing apparatus, method for measuring reflow temperature, and method for reflowing

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