A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer.

Lead Frame and Method For Manufacturing the Same

Provided are a metal-resin composite having excellent adhesive strength, a method for producing the same, a busbar, a module case, and a resinous connector part. The metal-resin composite comprises a metallic member 1 including a metal with a high melting point of 500°C or more, a resin member 2 being integrated with the metallic member 1; and an alloy layer 3 including a metal with a low melting point lower than 500°C. The alloy layer 3 is arranged between the metallic member 1 and the resin member 2, and has average surface roughness thereof in the range from 5nm or more to less than 1 µm at the interface between the alloy layer 3 and the resin member 2. Herein, a period of the unevenness formed on the interface of the alloy layer 3 is in the range from 5nm or more to less than 1 µm.

Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part

The invention belongs to the technical field of material, and particularly relates to a preparation method of a combined body of metal and resin. The preparation method comprises the following steps: firstly, depositing a micro pore layer on the surface of metal via an electric deposition method, wherein the micro pore layer is arranged to be a metal nickel micro pore layer or a metal nickel alloy micro pore layer; and secondly, combining resin with the surface of the metal processed in the step one in an injection molding mode for molding so as to obtain the combined body of metal and resin. According to the invention, the technical difficulties that multiple metal not suitable for surface treatment cannot be firmly combined with resin and different technologies are required for different metal are solved by an electric deposition method, and the diversification need of market is met; in addition, the invention also discloses the combined body of metal and resin.

Combined body of metal and resin and preparation method thereof

The invention discloses a metal-plastic composite structure and a manufacturing method thereof and a metal-plastic composite keycap structure. The metal-plastic composite structure comprises a metal substrate and a resin layer. The metal substrate comprises a first surface and a second surface opposite to the first surface, wherein a plurality of through holes are arranged on the metal substrate, penetrate through the metal substrate and are communicated with the first surface and the second surface. The resin layer is arranged at least one of the first surface and the second surface and filled with a plurality of through holes so that the resin layer is firmly combined with the metal substrate. The metal-plastic composite structure and the manufacturing method thereof are suitable for various resin materials, can be randomly matched with the surface treatment step and can be used for manufacturing the stable metal-plastic composite structure without the need of adhesives.

Metal-plastic composite structure and manufacturing method thereof and metal-plastic composite keycap structure

The invention relates to a semiconductor chip (1) comprising a metal coating structure (2) and an associated production method. Said metal coating structure (2) comprises at least one lower metal layer (8), which contains copper or a copper alloy, is located on an active upper face (3) of the semiconductor chip (1) and on which a central metal layer (9) comprising nickel is located. The metal coating structure (2) is finished by an upper metal layer (10) consisting of palladium and/or a precious metal. The central metal layer (9) comprising nickel and/or nickel phosphide has a rough interface (11) separating it from the plastic housing mass that surrounds the metal coating structure (2).

Semiconductor chip comprising a metal coating structure and associated production method

PROBLEM TO BE SOLVED: To provide a metal resin composite capable of improving an adhesive property to resin by an anchoring structure by making the surface uneven by forming a metal plated layer on a surface of the metal to roughen the surface and to provide its manufacturing method. SOLUTION: The metal plated layer (2) is formed on a surface of the metal (1) and its surface is roughened by an etching liquid. Thereafter the roughened metal plated layer (2) is bonded to the resin (3) to be integrated. A surface average roughness Ra of the metal plated layer (2) is ≥ 0.1μm and further preferably in a range of 0.2-0.8μm. The metal plated layer (2) should be made of copper or nickel. The surface roughness should be preferably formed by etching. Thus, a roughening treatment within the above-mentioned range can be effectively, inexpensively and accurately obtained. COPYRIGHT: (C)2004,JPO

Metal resin composite and its manufacturing method

The purpose of the present invention is to provide: an etching liquid which is capable of selectively etching titanium in the presence of copper, while having low toxicity and excellent storage stability; and an etching method which uses this etching liquid. An etching liquid according to the present invention contains: at least one acid that is selected from the group consisting of sulfuric acid, hydrochloric acid and trichloroacetic acid; and at least one organic sulfur compound that is selected from the group consisting of thioketone compounds and thioether compounds. This etching liquid is capable of selectively etching titanium in the presence of copper.

Etching liquid and etching method

PROBLEM TO BE SOLVED: To provide an etchant which is capable of selectively etching titanium in the presence of copper and has low toxicity and excellent storage stability, and to provide an etching method using the sameSOLUTION: The etchant of the present invention contains at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid and at least one organic sulfur compound selected from the group consisting of thioketone compounds and thioether compounds and is capable of selectively etching titanium in the presence of copperSELECTED DRAWING: None

Etchant and etching method

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Metal resin composite and its manufacturing method

Etching liquid and etching method

Etchant and etching method