A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing and manufacturing an integrated heat spreader would generate a heat spreader that would be built compensate for deformations resulting from (1) physical manipulation during assembly (2) thermal gradients during operation and (3) differing rates of expansion and contraction of the package materials coupled with multiple package assembly steps at elevated temperatures so that one surface of the integrated heat spreader would have a flat shape.

Device and method for package warp compensation in an integrated heat spreader

Thermo-mechanical finite element analysis in a multichip build up substrate based package design

A high performance multi-chip package with /spl sim/1300 I/O have been developed. This prototype package uses a build up (BU) laminate substrate with laser-drilled blind vias to provide the high density interconnections for substrate level integration as well as high I/O routing for the 2nd level interconnection to the PCB. Chip to substrate interconnection is by means of flipchip bonding and BGA solder ball for board attach. This paper describes the initial evaluation of reliability testing for the package with emphasis on microvia interconnection reliability and discusses the failure modes encountered with the multi-chip package.

Reliability assessment of flipchip on build up laminate based multi-chip package

A method of positioning at least 2 chips simultaneously on a substrate by parallel stochastic assembly in a first liquid, wherein the chips are directed to target sites on the substrate within the first liquid, the target sites being covered with a second liquid, the second liquid and the first liquid being immiscible, wherein the chips are attracting the first liquid, and on each chip a predetermined surface is chosen or treated such that it is selectively attracted by the second liquid and attracting the first liquid.

Method for performing parallel stochastic assembly

In this paper, thermal analysis of a three dimensional quarter model of a 156 pad flip-chip on a liquid cooled multichip module with 75 other chips is simulated using COSMOS-finite element software. Both flip-chip (pad grid array type) and TAB type of interconnections are used for the module. The total power on the board is 134 watts, the flip-chips generating up to 1.5 watts each and the one TAB type generating 12 watts. Each chip can be modeled independently due to the absence of cross-heating by its neighbors. Forced convection liquid cooling using an organic coolant with various flow rates and thus various convection coefficients is used for the study. The temperature rise in the boundary layer of the coolant was 8/spl deg/F at the coolant flow rate of 0.073 gallons per minute for the flip-chip with 1.5 watts. The maximum thermal strains calculated were found to be 0.37% (if the temperature of zero strain is assumed to be 0/spl deg/F, and Young's modulus of solder is 2 Mpsi). The maximum shears were found in the corner bump, and they differed from the next bump by 20%. Polyimide layers above and below the solder bumps were found to contribute about 80% of the thermal resistance. These results are used in a Coffin-Manson analysis to predict adequate life (cycles) for the high lead solder bumps (95%Pb-5%Sn). >

Thermal and mechanical analysis of flip-chips on a liquid cooled multichip module

This paper presents a thermo-mechanical analysis of a multichip module (MCM) package design, with emphasis on the package warpage, thermally induced stress and the 2nd level solder joint reliability. The MCM package contains four flip chips which are mounted on a build up substrate. Firstly, the effect of the positioning of four silicon dice within the MCM package on the package warpage was studied. Secondly, the effect of package dimensions (the heat spreader thickness, structural adhesive thickness and substrate thickness) on the maximum residual stress and warpage of the package were performed. Finally, this paper presents a 3D sliced model for solder joint reliability of the MCM assembly. A creep constitutive relation is adopted for the 63Sn/37Pb solder to account for its time and temperature dependence in thermal cycling. The fatigue life of the solder joints is estimated by Darveaux's approach. A series of parametric studies is performed by changing the package dimensions. The results obtained from the modeling are useful for the design of multichip packages.

Thermo-mechanical analysis for a multi chip build up substrate based package

In recent times there are many publications on guided self-assembly to generate heterogeneous and/or functional integrations, particularly in microelectronics area. A promising approach attempted in this investigation is self-assembly using capillary forces. In this approach, microcomponents flow over a target substrate patterned with binding sites, and part-substrate attachment and alignment occurs spontaneously due to free energy minimization of the binding site (e.g., a liquid column of lubricant). Silicon die chiplets (1 times 1 mm) are diced from gold sputtered and patterned 8" wafer. Correspondingly matching gold pattern arrays (10 times 10) made on 8" silicon wafer. Each gold pattern array is about 3times3 cm dimensions. Prior to assembly, both dies and gold patterned substrates were treated with thiol based self assembled monolayer (SAM). After SAM treatments on the substrate, lubricant is immobilized. Later the lubricant immobilized substrate wafer placed in a water bath. SAM treated dies allowed to pass on the substrate. The hydrophobic SAM treated face of the die attracted by hydrophobic lubricant sites on the substrate and assembled spontaneously aided by capillary force. Minimization of the free energy of the lubricant-water interface provided the driving force for the assembly. The X-ray diffraction characterizations of gold depositions are also performed to select gold deposition technique

Self assembly of microcomponents on patterned substrate using capillary force

Popular Tasks used by Researchers

How can I help with your research?

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

We encountered an error while loading the panel. Please try refreshing the page.

Something went wrong

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

Anyone with the link can view this chat. You can switch it back to private anytime.

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

M.K. Iyer

Author Tools

Chat about Author

Papers

Thermo-mechanical analysis for a multi chip build up substrate based package

Self assembly of microcomponents on patterned substrate using capillary force