Electroless copper plating baths include alternative reducing agents to the conventional reducing agents currently used in the electroless plating industry. The electroless copper baths are stable and deposit a salmon bright copper deposit on substrates. Exclusion of many environmentally unfriendly conventional reducing agents enables environmentally friendly electroless copper plating baths.

Electroless copper plating compositions

An electroless aqueous copper plating bath to which an aromatic nitro compound has been added as a stabilizer.

Electroless copper plating bath

The present invention relates to aqueous, alkaline plating bath compositions for electroless deposition of ternary and quaternary cobalt alloys Co-M-P, Co-M-B and Co-M-B-P, wherein M is selected from the group consisting of Mn, Zr, Re, Mo, Ta and W which comprise a propargyl derivative as the stabilising agent. The cobalt alloy layers derived there from are useful as barrier layers and cap layers in electronic devices such as semiconducting devices, printed circuit boards, and IC substrates.

Alkaline plating bath for electroless deposition of cobalt alloys

Provided is an electroless copper plating solution that forms a highly adhesive conductive film regardless of the degree of roughness of the resin surface and also has a fast deposition rate. The electroless copper plating solution of the present invention is characterized in that it contains guanosine. The electroless copper plating solution of the present invention preferably also contains copper ion, reducing agent, copper ion complexing agent, and pH adjuster.

Electroless copper plating solution

The quantity of an anionic material in a sample is determined by adjusting the pH of the sample to place the material in nonionic extractable form, extracting out the material, spectrophotometrically measuring the extracted material, and comparing the measured value to a standard in order to determine the quantity of the anionic material.

Determination of amount of anionic material in a liquid sample

Electroless copper plating solutions can be stabilized against autodecomposition by the addition of minute quantities of organothiophosphate compounds A secondary stabilizer or brightener of the propargyl-type gives added improvement

Electroless copper plating

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Electroless copper plating