The present invention provides an entry sheet for drilling excellent in hole position accuracy compared with the conventional entry sheet for drilling. Such an entry sheet for drilling is an entry sheet for drilling comprising metallic support foil and a layer comprising a resin composition formed on at least one surface of the metallic support foil, in which the resin composition contains a resin and 70 parts by mass to 130 parts by mass of molybdenum disulfide based on 100 parts by mass of the resin, and the layer comprising the resin composition has a thickness in a range from 0.02 to 0.3 mm.

Entry sheet for drilling

Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

Printed circuit board and method for manufacturing the same

A circuit board comprises press fit substrates and an inner layer circuit substrate which are pressed together. The inner layer circuit substrate comprises an insulating layer and a conducting line layer adhering to the surface of the insulating layer, the conducting line layer is provided with an exposure area and a press fit area, the surface of the exposure area is provided with an anti-welding layer, and a plurality of connecting pads of the exposure area are exposed out of the anti-welding layer. Every press fit substrate comprises adhesion rubber pieces, press fit rubber pieces and conductive pattern layers, wherein the adhesion rubber pieces, the press fit rubber pieces and the conductive pattern layers are pressed together and provided with openings. The adhesion rubber pieces are formed on a press fit area of the inner layer circuit substrate and are in contact with the press fit rubber pieces, grooves penetrating through the press fit substrates are formed in a multi-layer circuit board and correspond to the exposure area so that the anti-welding layer and the connecting pads exposed out of the anti-welding layer are exposed in the grooves, and the grooves are used for accommodating electronic components. The invention further provides a manufacturing method of the circuit board.

Circuit board and manufacturing method thereof

A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.

Picking-up and placing process for electronic devices and electronic module

The invention relates to a circuit board, which comprises a substrate, a first conductive line layer, a second conductive line layer, a first covering film and solder resist ink, wherein the first conductive line layer and the second conductive line layer are arranged at two opposite sides of the substrate; the second conductive line layer is provided with a connection area; the connection area is internally distributed with multiple electrical contact pads; the first conductive line layer comprises multiple first conductive lines; multiple gaps exist between the first conductive line layer and the first conductive lines in the region corresponding to the connection area; the first covering film covers the first conductive line layer; the region in the connection area corresponding to the first covering film is provided with multiple openings; the first openings and the gaps are in one-to-one correspondence so as to enable corresponding gaps to be exposed; and the solder resist ink fills the multiple first openings and the multiple gaps. The invention also relates to a circuit board manufacturing method.

Circuit board and circuit board manufacturing method

Manufacturing method for circuit board

A method for manufacturing a multilayer printed circuit board (PCB) includes the following steps in no particular order A photoresist layer is applied on an outer surface of an outer copper layer of a PCB substrate The photoresist layer is exposed and developed, thereby forming a plurality of apart arranged protrusions on the outer copper layer The protrusions cover a first portion of the outer copper layer while a second portion of the outer copper layer is exposed The second portion of the outer copper layer has the same pattern with that of predetermined electrically conductive traces The PCB substrate is electroplated, thereby forming an electroplated copper layer on the second portion of the outer copper layer An anti-etching layer is formed on the electroplated copper layer using an organic solderability preservative The protrusions are removed, thereby exposing the first portion of the outer copper layer The first portion of the outer copper layer is etched The anti-etching layer is removed, thereby obtaining a PCB having outer electrically conductive traces

Method for manufacturing multilayer printed circuit board

The invention relates to a method for manufacturing a circuit board. The method comprises the following steps of: providing a first copper foil layer, wherein the first copper foil layer has a first surface and a second surface, which are opposite; forming a first support layer on the first surface; forming a first circuit on the second surface by electroplating; forming a dielectric layer on thesecond surface, wherein the first circuit is contacted with the dielectric layer; removing the first support layer from the first surface; etching the first copper foil layer from the first surface so as to form a second circuit corresponding to the distribution position of the first circuit; and overlapping the first circuit and the second circuit to form a first circuit pattern.

Method for manufacturing circuit board

A method for manufacturing a printed circuit board includes steps below. Firstly, a first copper foil is provided. The first copper foil has a first surface and a second surface at an opposite side thereof to the first surface. Secondly, a first supporting layer is formed on the first surface of the first copper foil. Thirdly, a first circuit is formed on the second surface of the first copper foil by electroplating. Fourthly, a dielectric layer is formed on the second surface of the first copper foil, the first circuit is in contact with the dielectric layer. Fifthly, the first supporting layer is removed from the first surface of the first copper foil. Sixthly, the first copper foil is etched to form a second circuit. A distribution of the second circuit is corresponding to that of the first circuit, thus the first conductive circuit and the second conductive circuit overlap with each other thereby constituting a first circuit pattern.

Method for manufacturing printed circuit board

The invention discloses a spray etching device, which is used for spraying etching solution to etch a circuit board. The spray etching device comprises a plurality of spray pipes, a plurality of first connecting pipes and a plurality of spray heads, wherein each spray pipe is connected with the plurality of first connecting pipes; the ends of the first connecting pipe away from the spray pipes are connected with the corresponding spray heads; and the plurality of spray heads are used for spraying the etching solution onto the surface of the circuit board. The spray etching device further comprises a plurality of suction nozzles in one-to-one correspondence with the plurality of spray heads, and a plurality of second connecting pipes connected between the corresponding first connecting pipes and the corresponding suction nozzles, wherein the plurality of suction nozzles are close to the surface of the circuit board; and the first connecting pipes are used for generating negative pressures at joints of the first and second connecting pipes when the spray heads spray the etching solution so as to make the suction nozzles suck the redundant etching solution on the surface of the circuit board.

Spray etching device

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