Methods, systems, and apparatus, including medium-encoded computer program products, for three dimensional print adhesion reduction using photoinhibition include, in one aspect, a method including: moving a build plate in a vat of liquid including a photoactive resin; creating a photoinhibition layer within the liquid directly adjacent a window of the vat by directing a first light through the window into the liquid, the first light having a first wavelength selected to produce photoinhibition; and creating a solid structure on the build plate from the photoactive resin within a photoinitiation layer of the liquid by directing a second light through the window into the liquid, where the photoinitiation layer resides between the photoinhibition layer and the build plate, and the second light has a second wavelength different than the first wavelength.

Three dimensional printing adhesion reduction using photoinhibition

Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed from the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Olims/square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Olims/square. In addition to maintaining good transparency, the materials formed from the sintered metal nanowire networks can have a haze of no more than 0.5. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. The resulting sintered network can have a core-shell structure in which metal halide forms the shell. Additionally, effective methods are described for forming patterned structure with areas of sintered metal nanowire network with high conductivity and areas of un-sintered metal nanowires with low conductivity. The corresponding patterned films are also described. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency with low haze, making them suitable for transparent electrode, touch sensors, and other electronic/optical device formation.

Metal nanostructured networks and transparent conductive material

An apparatus for bottom-up fabrication of three dimensional objects, the apparatus comprising: a vat for a photosensitive polymer, the floor of the vat including a working surface arranged such that, in use, light incident on the working surface interacts with the photosensitive polymer at the working surface to fabricate a portion of the three dimensional object; a build platform capable of being inserted into the vat, the build platform having a planar surface; an elevator mechanism capable of adjusting the separation between the working surface of the vat and the planar surface of the build platform; and a rotation mechanism capable of varying the relative rotational position of the vat relative to the build platform, the relative rotation being about an axis which is normal to the working surface of the vat.

Apparatus for fabrication of three dimensional objects

Polymer binders, e.g., crosslinked polymer binders, have been found to be an effective film component in creating high quality transparent electrically conductive coatings or films comprising metal nanostructured networks. The metal nanowire films can be effectively patterned and the patterning can be performed with a high degree of optical similarity between the distinct patterned regions. Metal nanostructured networks are formed through the fusing of the metal nanowires to form conductive networks. Methods for patterning include, for example, using crosslinking radiation to pattern crosslinking of the polymer binder. The application of a fusing solution to the patterned film can result in low resistance areas and electrically resistive areas. After fusing the network can provide desirable low sheet resistances while maintaining good optical transparency and low haze. A polymer overcoat can further stabilize conductive films and provide desirable optical effects. The patterned films can be useful in devices, such as touch sensors.

Transparent conductive coatings based on metal nanowires and polymer binders, solution processing thereof, and patterning approaches

In one embodiment, an apparatus includes a substantially flexible substrate configured to bend at an edge between a first surface and a second surface of a device. The edge has an angle of deviation between the first and second surfaces of at least approximately 45°. The apparatus includes a touch sensor disposed on the substantially flexible substrate and configured to bend with the substantially flexible substrate at the edge between the first and second surfaces. The touch sensor includes drive or sense electrodes made of flexible conductive material configured to bend with the substantially flexible substrate at the edge between the first and second surfaces. The touch sensor has at least one active area on each of the first and second surfaces.

Touch Sensor for Curved or Flexible Surfaces

A quantum dot film article includes a first barrier film, a second barrier film, and a quantum dot layer separating the first barrier from the second barrier film. The quantum dot layer includes quantum dots dispersed in a polymer material. The polymer material includes a methacrylate polymer, an epoxy polymer and a photoinitiator.

Quantum dot film

Transparent conductive films comprising silver nanowires dispersed in polyvinyl alcohol or gelatin can be prepared by coating from aqueous solvent using common aqueous solvent coating techniques. These films have good transparency, conductivity, and stability. Coating on a flexible support allows the manufacture of flexible conductive materials.

Transparent conductive film comprising water soluble binders

A quantum dot film article includes a first barrier layer; a second barrier layer; and a quantum dot layer between the first barrier layer and the second barrier layer. The quantum dot layer has quantum dots dispersed in a matrix including a cured adhesive composition, wherein the adhesive composition includes: an epoxide; an amino-functional compound of Formula I: wherein A is a monocyclic or a polycyclic alkylene group, or a monocyclic or a polycyclic heteroalkylene group, and m and n are integers each independently selected from 0 to 5; and a radiation curable methacrylate compound.

Quantum dot article with improved edge ingress

The present disclosure relates to forming a bond with a high peel resistance between a bonding layer and an adjacent barrier layer. Such articles are particularly useful in the preparation of a device, in particular a luminescent device, and a method is described for assembly of the luminescent device. The luminescent device includes an encapsulation system using flexible transparent barrier film and an ultraviolet (UV) radiation curable (meth)acrylate matrix. The moisture sensitive luminescent material can be, for example, a quantum dot material disposed in a film, or a film construction that includes an OLED structure.

Adhesive barrier film construction

Disclosed is a transparent conductive film that comprises at least one carrier layer disposed on the opposite side of a transparent support from at least one conductive layer, and at least one hardcoat layer disposed on the at least one carrier layer. Such films, which exhibit superior hardness, adhesion, and curl, are useful for electronics applications.

Transparent conductive film with hardcoat layer

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