K. C. Li
National Tsing Hua University
6 Papers
6 Citations
K. C. Li is an academic researcher from National Tsing Hua University. The author has contributed to research in topics: Electronic circuit & Memristor. The author has an hindex of 3, co-authored 6 publications.
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Papers
A 65nm 1Mb nonvolatile computing-in-memory ReRAM macro with sub-16ns multiply-and-accumulate for binary DNN AI edge processors
Wei-Hao Chen,K. C. Li,Wei-Yu Lin,K. C. Hsu,Pin-Yi Li,Cheng-Han Yang,Cheng-Xin Xue,En-Yu Yang,Yen-Kai Chen,Yun-Sheng Chang,Tzu-Hsiang Hsu,Ya-Chin King,Chorng-Jung Lin,Ren-Shuo Liu,Chih-Cheng Hsieh,Kea-Tiong Tang,Meng-Fan Chang +16 more
- 01 Feb 2018
TL;DR: Many artificial intelligence (AI) edge devices use nonvolatile memory (NVM) to store the weights for the neural network (trained off-line on an AI server), and require low-energy and fast I/O accesses.
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CMOS-integrated memristive non-volatile computing-in-memory for AI edge processors
Wei-Hao Chen,Chunmeng Dou,K. C. Li,Wei-Yu Lin,Pin-Yi Li,Jian-Hao Huang,Jing-Hong Wang,Wei-Chen Wei,Cheng-Xin Xue,Yen-Cheng Chiu,Ya-Chin King,Chorng-Jung Lin,Ren-Shuo Liu,Chih-Cheng Hsieh,Kea-Tiong Tang,Jianhua Yang,Mon-Shu Ho,Meng-Fan Chang +17 more
- 01 Sep 2019
TL;DR: A fully integrated memristive nvCIM structure that integrates a resistive memory array with control and readout circuits using an established 65 nm foundry CMOS process, can offer high energy efficiency and low latency for Boolean logic and multiply-and-accumulation operations.
224
Stencil evaluation of ultra fine pitch solder paste printing process
Jimmy Yang,Jay Cy Huang,Vincent Lee,Jojo Tsai,J. L. Ku,K. C. Li,Ander Hsieh,Cheng Yu Chen +7 more
- 01 Oct 2010
TL;DR: In this article, the authors used measuring tools combined with statistical methods to investigate the effects of laser cutting taper angle and speed on the stencil quality, which is defined by the amount of stainless steel residues after laser cutting and the roundness of stencil aperture.
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Failure analysis of ENIG surface finish pad
Jimmy Yang,Jay Cy Huang,Mike Huang,J. L. Ku,Ander Hsieh,K. C. Li +5 more
- 01 Oct 2010
TL;DR: In this paper, the authors investigated the root cause of component fell-off from hand-held products after drop test and concluded that the failure may be related to the black pad issue.
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Reliability assessment for the PoP lead free solder joint through temperature cycling test
Jimmy Yang,Jay Cy Huang,K. C. Li,J. L. Ku,Andrew Lee +4 more
- 01 Oct 2010
TL;DR: In this article, the failure location is at interface between component pad and the solder joint due to the CTE mis-match between bottom chip and the PCB, and the expected life for the PoP solder joint is determined to be 5600 cycles in the temperature range of 0°C to 100°C.
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