Jun-Hyub Park
Samsung
58 Papers
368 Citations
Jun-Hyub Park is an academic researcher from Samsung. The author has contributed to research in topics: Ultimate tensile strength & Fatigue limit. The author has an hindex of 14, co-authored 56 publications.
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Papers
Machine learning-based imaging system for surface defect inspection
TL;DR: This paper proposes a method for automatic visual inspection of dirties, scratches, burrs, and wears on surface parts that has several advantages in time and cost saving and shows higher performance than traditional manpower inspection system.
286
Characterization of elastic moduli of Cu thin films using nanoindentation technique
TL;DR: In this article, the elastic moduli in both perpendicular and parallel directions to surface of Cu thin film were investigated by nanoindentation test and micro-cantilever beam bending test and compared with the theoretical estimations of elastic modulations based on the texture analysis.
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Patent
Ink-jet print head and method thereof
Jae-Sik Min,Seo-hyun Cho,Sang-Wook Lee,Jun-Hyub Park,Yong-Shik Park,Kyong-il Kim +5 more
- 04 Dec 2002
TL;DR: In this article, an ink-jet print head preventing thermal accumulation on a nozzle plate includes a substrate, a channel formed in the substrate to supply ink, a nozzle, and a thermal shunt spaced-apart from the heat element by a predetermined distance not to overlap the heat elements in a direction parallel to the nozzle plate.
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Tensile and high cycle fatigue test of Al–3% Ti thin films
TL;DR: In this article, the results of tensile and high cycle fatigue tests with stress ratio R = 0.1 for an Al-3% Ti thin film of 1μm thickness in atmospheric air at room temperature were presented.
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Tensile and high cycle fatigue test of copper thin film
TL;DR: In this paper, the results of tensile and high cycle fatigue tests for copper thin film were presented, where the results were performed with the specimen using the test machine developed by the authors.
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