The utility model discloses a chemical polishing system for liquid-phase epitaxial substrates According to the system, a substrate vacuum adsorption system is used for solving the problems of poor surface evenness, frangibility and tedious chemical cleaning caused by wax sticking procedures A groove with the depth identical with the substrate thickness required by processes is formed in a sample disk in the vacuum adsorption system, and an alarm bell is set for reminding, so that when the substrate thickness reaches a predetermined target, the alarm bell makes a sound to remind an operator of taking out of the substrates The chemical polishing system has the advantages that the substrate thickness can be controlled accurately, and the influence of the substrate thickness on the tellurium-cadmium-mercury horizontal liquid-phase epitaxial layer quality is eliminated

Chemical polishing system for liquid-phase epitaxial substrates

The utility model provides a weight for reduction of semiconductor wafer wear, which comprises a heavy weight. The upper surface of the heavy weight is provided with a groove used for accommodating awafer, and the depth of the groove is equal to the sum of the required thickness of the wafer and the thickness of the bonding layer. When the utility model is reduced for reducing the wear of the wafer, the wafer is arranged in the groove of the heavy weight. When the wafer is thinned to the required thickness, even if the preset grinding time of the grinding machine is not reached, the wear of the wafer can not be reduced continuously, and the wafer rubs against the upper surface of the heavy weight to stop the grinding of the wafer and to prevent the wafer from being thinned further until the grinding time runs out, thereby protecting the wafer and preventing the thinning or wasting of the wafer due to the high wafer thinning speed.

Weight for reduction of semiconductor wafer wear

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Weight for reduction of semiconductor wafer wear