A mechanism is provided for a thermal power plane that delivers power and constitutes minimal thermal resistance. The mechanism comprises a processor layer coupled, via a first set of coupling devices, to a signaling and input/output (I/O) layer and a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the mechanism, the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism. In the mechanism, the power delivery layer comprises a plurality of conductors, a plurality of insulating materials, one or more ground planes, and a plurality of through laminate vias. In the mechanism, the signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Thermal power plane for integrated circuits

A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Optimized semiconductor packaging in a three-dimensional stack

A mechanism is provided for integrated power delivery and distribution via a heat sink. The mechanism comprises a processor layer coupled to a signaling and input/output (I/O) layer via a first set of coupling devices and a heat sink coupled to the processor layer via a second set of coupling devices. In the mechanism, the heat sink comprises a plurality of grooves on one face, where each groove provides either a path for power or a path for ground to be delivered to the processor layer. In the mechanism, the heat sink is dedicated to only delivering power and does not provide data communication signals to the elements of the mechanism and the signaling and I/O layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits

An integrated circuitry structure includes at least first and second regions An optical layer includes optical waveguides A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink

Transferring heat through an optical layer of integrated circuitry

Dreidimensionale VLSI-Einheit (200), aufweisend: eine Prozessorschicht (202), die uber eine erste Menge von Verbindungseinheiten (210) mit mindestens einer Signalisierungs- und Eingabe/Ausgabe-Schicht (208) verbunden ist; und einen Kuhlkorper (302), der uber eine zweite Menge von Verbindungseinheiten mit der Prozessorschicht verbunden ist, wobei: der Kuhlkorper an einer Flache eine Vielzahl von Nuten (304) aufweist, jede Nut in der Vielzahl von Nuten entweder einen Pfad fur Strom oder einen Pfad fur Masse bereitstellt, die der Prozessorschicht zugefuhrt werden sollen, der Kuhlkorper nur zur Zufuhr von Strom ausgestaltet ist und den Elementen der dreidimensionalen VLSI-Einheit keine Datenaustauschsignale bereitstellt, und die mindestens eine Signalisierungs- und Eingabe/Ausgabe-Einheit nur zum Ubertragen der Datenaustauschsignale an die Prozessorschicht und zum Empfangen der Datenaustauschsignale von der Prozessorschicht ausgestaltet ist und den Elementen der Prozessorschicht keinen Strom bereitstellt.

In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen sowie 3-D-VLSI-Einheit, Datenverarbeitungssystem und Verfahren damit

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Transferring heat through an optical layer of integrated circuitry

In den Kühlkörper integrierte Stromversorgung und Stromverteilung für integrierte Schaltungen sowie 3-D-VLSI-Einheit, Datenverarbeitungssystem und Verfahren damit