Multifunctional polymer composites with anisotropic properties are attracting interest as they fulfil the growing demand of multitasking materials. In this work, anisotropic polymer composites have been fabricated by combining the layer-by-layer (LBL) filtration method with the alternative assembling of carbon nanotubes (CNTs) and hexagonal boron nitride flakes (hBN) on natural rubber latex particles (NR). The layered composites exhibit anisotropic thermal and electrical conductivities, which are tailored through the layer formulations. The best composite consists of four layers of NR modified with 8 phr (parts per Hundred Rubber) CNTs (∼7.4 wt%) and four alternate layers with 12 phr hBN (∼10.7 wt%). The composites exhibit an electromagnetic interference (EMI) shielding effectiveness of 22.41 ± 0.14 dB mm−1 at 10.3 GHz and a thermal conductivity equal to 0.25 W m−1 K−1. Furthermore, when the layered composite is used as an electrical thermal heater the surface reaches a stable temperature of ∼103 °C in approx. 2 min, with an input bias of 2.5 V.

/pdf/an-anisotropic-layer-by-layer-carbon-nanotube-boron-nitride-3vjh4w0vnb.pdf

An anisotropic layer-by-layer carbon nanotube/boron nitride/rubber composite and its application in electromagnetic shielding

Preparation of polymer brush/Ni particle and its application in electroless copper plating on PA12 powder

In this work, a facile method combined with catalyst solution (mixture of AgNO3, 3-aminopropyltriethoxysilane, alcohol, SiO2 particle and deionized water) printing and electroless deposition to fabricate selective copper coating is demonstrated. The catalyst solution can write onto (polyethylene terephthalate (PET)) surface directly with good stability and resolution. The structure can catalyze plating reaction. SiO2 particle can enhance surface roughness (Sr) of catalyst coating. Effects of Sr on electronic, adhesive force and structural properties of copper coating are investigated. High Sr can facilitate the enhancement of Ag-adsorbed amount, deposition rate, adhesive force, crystallinity and electrical stability of plated coating. When the Sr is 0.78 µm, the thickness of copper coating is 2.5 µm, minimum width of copper line is 250 µm, the resistivity is 2.1 × 10−6 Ω cm, adhesion of 2.5 µm thick coating is 5B.

A facile process to fabricate electroless plating on PET sheet: Effects of surface roughness on adhesive force, electronic and structural properties of copper coating

It is highly desired to simplify the technology of electroless plating on inert polymer. Herein we developed a new kind of catalytic solution (mixture of H2O, AgNO3 and 3-aminopropyltriethoxysilane), which can write onto inert polymer directly with good stability, resolution and catalytic performance. Then, a facile method combined with catalyst solution printing and electroless plating to fabricate selective metal (copper and nickel) coating on polymer (polypropylene and polyethylene terephthalate) surface. The growth behavior, electrical, and structural properties of plated coating were investigated. The minimum width of copper coating is 250 μm, thickness is 2.2 μm, resistivity is 2.6 × 10−6 Ω cm, adhesion of 2.2 μm thick coating maintain 5B. In addition, the selective metal coating have excellent bending and fatigue resistance.

A facile method combined with catalyst solution printing and electroless plating to fabricate selective metal coating on inert polymer

The invention relates to a method for surface metallization of a polymer substrate. The method comprises the following steps of (1) conducting graft modification on the substrate surface after the polymer substrate is cleaned; (2) enabling the polymer substrate surface obtained from the step (1) to adsorb catalysts; (3) carrying out chemical plating on the polymer substrate after being processed in the step (2) to obtain the surface metallized polymer substrate. The method for surface metallization of the polymer substrate is good in polymer substrate universality and wide in application range; an operation method is easy and feasible, there is no need for a large-scale instrument, and most importantly, the binding force of a metal layer formed at the polymer substrate surface is good and can meet product requirements.

Method for surface metallization of polymer substrate and application of surface metallized polymer substrate

In this work, the region-selective electroless copper plating on the surface of calcium carbonate (CaCO3)-filled polyehtylene (PE) (CFP) films have been established based on printing primer by screen printing in combination with electroless copper plating. Results showed only the printed areas formed amine groups on the surface of CFP sheets, which served as cores for adsorbing Pd2+ ions. Thus, the pattern on the screen was transferred to the surface of CFP sheets after electroless plating. When the plated time increased from 5 to 120 min, the thickness of plated coating was enhanced from 0.12 to 10 μm and the electrical resistivity was decreased from 12,544 to 0.4 Ω cm. The blown PE films mixed with foam powders and CaCO3 powders could form the coarse surface which can provide a large area for mechanical anchor between the primer and the plated coating, resulting in a better adhesion of the plated coating. In addition, the copper patterning possessed excellent selectivity, compactness, and flexibility. The EMI-SE of plated CFP films is above 30 dB.

High-adhesive electroless copper plating on polyethylene surface modified with primer

The invention relates to a selective chemical plating method for polymer substrate surfaces. The method includes the steps: (a) performing pretreatment for the polymer substrate surfaces; (b) printing base coat on the polymer substrate surfaces by the aid of a coating process, and drying; (c) selectively printing sensitizing solution on the polymer substrate surfaces; (d) immerging polymer substrates into activating solution to activate; (e) chemically plating to obtain surface selectivity metallization polymer substrates. The method is simple in process and low in cost and has excellent selectivity and application prospects in fields such as flexible printed circuit boards and integrated circuits.

Selective chemical plating method for polymer substrate surfaces

The invention discloses a mold release agent for thermosetting resin The mold release agent comprises, by weight, 20-80 parts of porous inorganic powder, 05-10 parts of foaming agents, 1-10 parts ofnano-silicon dioxide, 2-10 parts of waterborne silicone oil, 40-90 parts of film-forming resin and 05-3 parts of flatting agents A preparation method of the mold release agent for the thermosettingresin includes the steps: (1) placing dispersing agents and deionized water into a dispersion machine to stir for 5min at high speed, and adding inorganic porous powder with particle diameters ranging from 600 meshes to 2000 meshes to continue to stir mixture for 10min; (2) adding the foaming agents in inorganic porous powder dispersion liquid acquired in the step (1), adding the film-forming resin again, and stirring mixture for 10min at high speed; (3) adding the nano-silicon dioxide into mixed liquid acquired in the step (2), adding the waterborne silicone oil and the flatting agents again, and stirring mixture for 20min at high speed The mold release agent has the advantages that the prepared mold release agent for the thermosetting resin is good in mold release effect and can improve surface mechanical properties of thermosetting resin products, and molds can be repeatedly released when being coated with the mold release agent once

Mold release agent for thermosetting resin and preparation method of mold release agent

The invention belongs to the field of grinding aids, and particularly relates to a special grinding aid for calcium carbonate powder and a use method of the special grinding aid. The grinding aid comprises a component A and a component B, wherein the component A is an active substance containing amino groups (or imino groups) and sulfonic groups, and the component B is an active substance containing a C-C long chain. According to the application requirement of the grinding aid product, the component A and the component B are added into water according to a certain proportion and stirred. According to the special grinding aid for calcium carbonate provided by the invention, the grinding aid contains a large amount of active substances, so that efficient grinding aiding and modification canbe simultaneously realized on superfine inorganic powder; in addition, the surface performance of the grinding-aid calcium carbonate can be regulated and controlled by controlling the relative contentof the two components.

Special grinding aid for calcium carbonate powder and use method of special grinding aid

In this work, further ion-beam was performed on SiO2-matrix B-doped Si-NC (SBC) thin films in order to enhance conductivity. The effect of ionbeam type on the electrical properties of SBC thin films was investigated systematically. The results indicated that the conductivities of SBC thin films were significantly improved by both argon and hydrogen ion-beam treatments, and the higher the hydrogen ion ratio, the higher the conductivity of SBC thin films. The conductivity of SBC thin films was increased from 1.82 × 10−6 S/cm to 3.2 × 10−3 S/cm with following hydrogen-ion-beam treatment. The change in conductivity of SBC thin films was most possibly resultant from the ion-beam treatment facilitating the formation of higher superficial order and lower defects. An alternative method was proposed to prepare high-conductivity SBC thin films, which may be applied to other heterogeneous thin films.

High-conductivity SiO 2 -matrix B-doped Si-NC thin films by following ion-beam treatment

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