Holger Gaul

TL;DR: In this article, an ultrasonic oscillation was recorded with a high speed camera to quantify the duration of the friction phase and the end of friction (EOF) with a pulsed LED light-source.

TL;DR: In this article, the ultrasonic transversal force transmitted to a chip during ultrasonic bonding is derived from measurements of the vibration amplitude at the tool tip and the die edge.

TL;DR: In this article, a friction power model is used to derive the ultrasonic friction power during Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensively in the microelectronics industry for interconnections to integrated circuits.

TL;DR: In this paper, a method for generating wire bond between a wire (3) and an electrical contact member (4), the method comprising the steps of pressing a first surface (A(t)) of a portion (3a) of the wire against a second surface (S), with a first force (Fnb) normal to the second surface while vibrating the portion of the wires along the second surfaces in order to generate a bond, measuring the time dependent vibration amplitude (a(t)), which is a direct measure of the stability of the bond at the respective time step.