By doping an organic compound functioning as an electron donor (hereinafter referred to as donor molecules) into an organic compound layer contacting a cathode, donor levels can be formed between respective LUMO (lowest unoccupied molecular orbital) levels between the cathode and the organic compound layer, and therefore electrons can be injected from the cathode, and transmission of the injected electrons can be performed with good efficiency. Further, there are no problems such as excessive energy loss, deterioration of the organic compound layer itself, and the like accompanying electron movement, and therefore an increase in the electron injecting characteristics and a decrease in the driver voltage can both be achieved without depending on the work function of the cathode material.

Light Emitting Device

The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate is described. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that also overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die.

Wafer-level chip scale package and method for fabricating and using the same

A semiconductor device includes: a semiconductor chip mounted on a mounting substrate; a first resin filling a gap between the chip and the substrate; a frame-shaped stiffener surrounding the chip; a first adhesive for bonding the stiffener to the substrate; a lid for covering the stiffener and an area surrounded by the stiffener; and a second resin filling a space between the stiffener and the chip. A thermal expansion coefficient of the second resin is smaller than that of the first resin. The first resin includes an underfill part filling a gap between the chip and the substrate and a fillet part extended from the chip region.

Warp-suppressed semiconductor device

A flexible elongate member such as a pressure guide wire (1000) includes an electrical device such as a pressure sensor (1002). The pressure sensor (1002) is electrically connected to conductive bands (304, 306 and 308) located on electrical connector (300). The electrical connector is attached to core wire (602) and shaft or hypotube (704). The use of electrical connector (300) helps minimize the assembly time of pressure guide wire (1000), as well as minimize some of the assembly problems associated with prior art designs such as pressure guide wire (100).

Flexible elongate member having one or more electrical contacts

To provide a highly reliable semiconductor device structure that enables cost reduction in the production of packages, inclusive of the cost for chips, and may cause less changes in connection resistance even under conditions of a long-term environmental resistance test. In a semiconductor device comprising a semiconductor chip face-down bonded to a wiring board, it has a structure wherein projecting metal portions are provided at the opposing wiring board terminals without forming bumps on bonding pads of the chip, the whole chip surface is bonded with an organic, anisotropic conductive adhesive material, and the whole or at least an edge of the back of the chip is covered with a sealing material.

Method of production of semiconductor device

A semiconductor device structure for reliable semiconductor devices suffering less changes in their connection resistance in a long environmental test period, while reducing the manufacturing cost of the package including the chip. In the manufacture of a semiconductor device using a face-down semiconductor chip, metal bumps are formed on the substrate instead of those on the bonding pad of the chip, the entire chip surface is bonded with an organic, anisotropic conductive organic adhesive, and the entire or a part of the back face of the chip including at least the edges is covered with a sealing material.

Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device

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Method of production of semiconductor device

Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device