PROBLEM TO BE SOLVED: To provide an Ag nanopaste for forming a joint capable of performing a residue-less joint where the occurrence of voids can be suppressed, storage stability is excellent and a residue does not occur.SOLUTION: An Ag nanopaste is dispersed with Ag nanoparticles having an average particle diameter of 1-1,000 μm in at least one kind of solvent selected from among ethylene glycol monophenyl ether, ethylene glycol monobenzyl ether and α-terpineol and contains the solvent of 30-70 vol.% and the balance Ag. The dispersibility of Ag nanoparticles is excellent in spite of not containing an additive and the like such as a rosin, a thixotropic agent and the like being the causes of a residue.SELECTED DRAWING: Figure 1

Ag NANOPASTE FOR FORMING RESIDUE-LESS TYPE JOINT

Provided are: a connection structure in which the occurrence of warpage and cracks are suppressed, even if stress is applied to the connection structure; metal atom-containing particles used for assembling said connection structure; and a bonding composition. The connection structure (A) is provided with an adhesive layer (50) including metal atom-containing particles (10) and a sintered body (20) of metal particles. Said metal atom-containing particles (10) and said sintered body (20) are in contact via a chemical bond, and in a cross-section of said adhesive layer (50), at least 5% of the outer periphery of said metal atom-containing particles (10) are in contact with said sintered body.

Connection structure, metal atom-containing particles and bonding composition

Provided are a sintered material excellent both in thermal stress and joining strength, a connection structure provided with the sintered material, a joining composition whereby the sintered material can be manufactured, and a method for manufacturing the sintered material. A base part 1, a buffer part 2, and a filling part 3 are provided in the sintered material. The buffer part 2 and the filling part 3 are dispersed in the base part 1. The base part 1 is a metal sintered compact, the buffer part 2 is formed by a vacancy and/or a material not the same as the sintered compact, and the filling part 3 is formed by particles and/or fibers. The expression A > B is satisfied, where A is the kurtosis of the volume distribution of the buffer part in a three-dimensional image of the sintered material and B is the kurtosis of the volume distribution of the buffer part in a three-dimensional image of the sintered material with the filling part removed therefrom.

Sintered material, connection structure, composite particle, joining composition, and method for manufacturing sintered material

PROBLEM TO BE SOLVED: To provide a bonding body which can enhance bond strength even for a sintered compact.SOLUTION: A bonding body 3 is a conductive bonding body for bonding a first conductor 1 having a first bonding surface 11 and a side face 12 extending therefrom, and a second conductor 2 having a second bonding surface 21 disposed so as to face the first bonding surface 11 and be larger than the first bonding surface 11. The bonding body 3 has a bonding layer 31 arranged between the first bonding surface 11 and second bonding surface 21, and a fillet 32 continuous to the bonding layer 31 and extending from the side face 12 of the first conductor 1 toward the second bonding surface 21 of the second conductor 2. The bonding layer 31 and fillet 32 are constituted to include a silver-based sintered portion 33 forming the basic skeleton thereof, and a conductive spacer 34 distributed into the sintered portion 33.

Bonding body and production method thereof

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Bonding body and production method thereof