Process for preparing oriented, organic, thermoplastic polymeric film

Stabilization of polyvinyl fluoride

Balanced pressure pump

A process of sealing a semiconductor substrate by contacting the semiconductor substrate with a surface of a release layer (I) of a gas barrier release film that is in the form of a mold, which includes vacuum suction; injecting a sealing resin between the semiconductor substrate and the mold; and releasing said mold from said semiconductor substrate having said sealing resin present thereon, where the gas barrier release film has a release layer (I), which has excellent releasability; a plastic support layer (II) supporting the release layer; and a metal or a metal oxide gas restraint layer (III), present between the release layer and the support layer, where the gas barrier release film exhibits a xylene gas permeability of at most 5×10−15 (kmol m/(s·m2·kPa)) at 170° C., and a surface of said release layer (I) has an arithmetic surface roughness of from 0.15 to 3.5 μm, exhibiting a satin-finish.

Release film for semiconductor resin molds

To provide a release film which has an extremely low gas permeability, an enormously small mold contamination by a mold resin and a high releasability. A gas barrier release film for semiconductor resin molds, comprising a release layer (I) having excellent releasability, a plastic support layer (II) supporting the release layer, and a gas restraint layer (III) made of a metal or a metal oxide, formed between the release layer and the support layer, and having a xylene gas permeability of at most 10 -15 (kmol m/(s·m 2 ·kPa)) at 170°C. The release layer (I) is preferably formed from a fluororesin such as an ethylene/tetrafluoroethylene copolymer, and a metal oxide layer is preferably a layer of an oxide such as an aluminum oxide, a silicon oxide or a magnesium oxide.

Mold release film for semiconductor resin mold

Hazy polyvinyl fluoride film and process

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Hazy polyvinyl fluoride film and process