Preface 1. Basic tools 2. Elasticity and Hooke's law 3. Seismic wave propagation 4. Effective media 5. Granular media 6. Fluid effects on wave propagation 7. Empirical relations 8. Flow and diffusion 9. Electrical properties Appendices.

/pdf/the-rock-physics-handbook-tools-for-seismic-analysis-of-58lw74s1oi.pdf

The Rock Physics Handbook: Tools for Seismic Analysis of Porous Media

Bound states in the continuum (BICs) are waves that remain localized even though they coexist with a continuous spectrum of radiating waves that can carry energy away. Their very existence defies conventional wisdom. Although BICs were first proposed in quantum mechanics, they are a general wave phenomenon and have since been identified in electromagnetic waves, acoustic waves in air, water waves and elastic waves in solids. These states have been studied in a wide range of material systems, such as piezoelectric materials, dielectric photonic crystals, optical waveguides and fibres, quantum dots, graphene and topological insulators. In this Review, we describe recent developments in this field with an emphasis on the physical mechanisms that lead to BICs across seemingly very different materials and types of waves. We also discuss experimental realizations, existing applications and directions for future work. The fascinating wave phenomenon of ‘bound states in the continuum’ spans different material and wave systems, including electron, electromagnetic and mechanical waves. In this Review, we focus on the common physical mechanisms underlying these bound states, whilst also discussing recent experimental realizations, current applications and future opportunities for research.

pdf/bound-states-in-the-continuum-ysynzoukox.pdf

Bound states in the continuum

The mechanical properties of thin films on substrates are described and studied. It is shown that very large stresses may be present in the thin films that comprise integrated circuits and magnetic disks and that these stresses can cause deformation and fracture to occur. It is argued that the approaches that have proven useful in the study of bulk structural materials can be used to understand the mechanical behavior of thin film materials. Understanding the mechanical properties of thin films on substrates requires an understanding of the stresses in thin film structures as well as a knowledge of the mechanisms by which thin films deform. The fundamentals of these processes are reviewed. For a crystalline film on a nondeformable substrate, a key problem involves the movement of dislocations in the film. An analysis of this problem provides insight into both the formation of misfit dislocations in epitaxial thin films and the high strengths of thin metal films on substrates. It is demonstrated that the kinetics of dislocation motion at high temperatures are expecially important to the understanding of the formation of misfit dislocations in heteroepitaxial structures. The experimental study of mechanical properties of thin films requires the development and use of nontraditional mechanical testing techniques. Some of the techniques that have been developed recently are described. The measurement of substrate curvature by laser scanning is shown to be an effective way of measuring the biaxial stresses in thin films and studying the biaxial deformation properties at elevated temperatures. Submicron indentation testing techniques, which make use of the Nanoindenter, are also reviewed. The mechanical properties that can be studied using this instrument are described, including hardness, elastic modulus, and time-dependent deformation properties. Finally, a new testing technique involving the deflection of microbeam samples of thin film materials made by integrated circuit manufacturing methods is described. It is shown that both elastic and plastic properties of thin film materials can be measured using this technique.

Mechanical properties of thin films

The purpose of the present survey is to review the analysis of composite materials from the applied mechanics and engineering science point of view. The subjects under consideration will be analysis of the following properties of various kinds of composite materials: elasticity, thermal expansion, moisture swelling, viscoelasticity, conductivity (which includes, by mathematical analogy, dielectrics, magnetics, and diffusion) static strength, and fatigue failure.

Analysis of Composite Materials—A Survey

1. Introduction and overview 2. Film stress and substrate curvature 3. Stress in anisotropic and patterned films 4. Delamination and fracture 5. Film buckling, bulging and peeling 6. Dislocation formation in epitaxial systems 7. Dislocation interactions and strain relaxation 8. Equilibrium and stability of surfaces 9. The role of stress in mass transport.

Thin Film Materials: Stress, Defect Formation and Surface Evolution

We Study cracks either in piezoelectrics, or on interfaces between piezoelectrics and other materials such as metal electrodes or polymer matrices. The projected applications include ferroelectric actuators operating statically or cyclically, over the major portion of the samples, in the linear regime of the constitutive curve, but the elevated field around defects causes the materials to undergo hysteresis locally. The fracture mechanics viewpoint is adopted—that is, except for a region localized at the crack tip, the materials are taken to be linearly piezoelectric. The problem thus breaks into two subproblems: (i) determining the macroscopic field regarding the crack tip as a physically structureless point, and (ii) considering the hysteresis and other irreversible processes near the crack tip at a relevant microscopic level. The first Subproblem, which prompts a phenomenological fracture theory, receives a thorough investigation in this paper. Griffith's energy accounting is extended to include energy change due to both deformation and polarization. Four modes of square root singularities are identified at the tip of a crack in a homogeneous piezoelectric. A new type of singularity is discovered around interface crack tips. Specifically, the singularities in general form two pairs: r1/2±ieand r1/2±ie, where e. and k are real numbers depending on the constitutive constants. Also solved is a class of boundary value problems involving many cracks on the interface between half-spaces. Fracture mechanics are established for ferroelectric ceramics under smallscale hysteresis conditions, which facilitates the experimental study of fracture resistance and fatigue crack growth under combined mechanical and electrical loading. Both poled and unpoled fcrroelectrie ceramics are discussed.

Fracture mechanics for piezoelectric ceramics

The six-dimensional framework developed by Stroll to treat dislocations and line forces in classical anisotropic elastic media is extended to an eight-dimensional formalism to treat dislocated piezoelectric insulators. The solutions are recast into a four-dimensional form using the so-called integral formalism developed previously by the authors. This technique allows one to compute the gradients of the mechanical displacement and the electrostatic potential as well as the total energy of the dislocated piezoelectric by merely computing three constant real (4 × 4) matrices using numerical integration, numerically a considerably simpler method than the prescription attached to the original Stroh formalism.

Dislocations and line charges in anisotropic piezoelectric insulators

Anisotropic continuum theory of lattice defects

A general theory is presented for the elastic interactions in a composite plate of layers with different relaxed planar dimensions. Solutions are obtained for the case of equivalent elastic properties and for the case of different elastic properties among the layers. Approximations for the case of thin films on a substrate lead to the governing equations for stresses in multilayered thin‐film systems. Finally, the experimental determination of the planar substrate strain, which is first order in the film/substrate thickness ratio, is presented as a rigorous test of the correctness of the theory.

Elastic relationships in layered composite media with approximation for the case of thin films on a thick substrate

In layered manufacturing, objects are constructed by sequential deposition of material layers. When the deposition process involves temperature gradients, thermal stresses develop. This paper examines the effect of deposition patterns on the resulting stresses and deflections in laser deposited metal parts. Finite element modeling of the deposition processes showed that the deposition pattern has a significant effect on the part stresses and deflections. Experiments performed using these same deposition patterns yielded sample deflections, which were in agreement with the finite element modeling predictions.

Thermal stresses and deposition patterns in layered manufacturing

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